Alfa Chemistry Materials 3 - Products
Alfa Chemistry Materials is specialized in material chemistry and offers an extensive catalog of materials in a wide range of applications, including Metals and Materials, 3D Printing Materials, Biomaterials.
| Product | Description | |
|---|---|---|
| CoCrNi High-Entropy Alloy Spherical Powder | We are engaged in the development, production, and sales of CoCrNi high entropy alloy spherical powder and provide personalized customization service for high-quality metal powder. CoCrNi high entropy alloy spherical powder is a new alloy with very unique properties. Uses: Cocrni high-entropy alloy spherical powder is widely used in aerospace parts and auto parts, profile surface spraying, powder metallurgy, nuclear energy and industrial fields. Group: High entropy alloys. |  |
| CoCrW High-Entropy Alloy Ingots | We are engaged in the development, production, and sales of CoCrW High-Entropy Alloy Ingots and provide personalized customization service for high-quality metal powder. CoCrW High-Entropy Alloy is a new alloy with very unique properties. Uses: Used in manufacturing super alloys and electron-beam melting. used in metallurgical, machinery processing, glass, and ceramic industries. used in electronics industry, such as integrated circuits. used in the field of glass coating. Group: High entropy alloys. Pack Sizes: Our CoCrW High-Entropy Alloy Ingot is carefully handled during storage and transportation to preserve the quality of our product in its original condition. 0.99. | |
| CoCrW High-Entropy Alloy Spherical Powder | We are engaged in the development, production, and sales of CoCrW high entropy alloy spherical powder and provide personalized customization service for high-quality metal powder. CoCrW high entropy alloy spherical powder is a new alloy with very unique properties. Uses: Cocrw high-entropy alloy spherical powder is widely used in aerospace parts and auto parts, profile surface spraying, powder metallurgy, nuclear energy and industrial fields. Group: High entropy alloys. | |
| Co-doped Nb2CTx Multilayer Mxene | Co-doped Nb2CTx Multilayer Mxene. Uses: Energy storage, catalysis, analytical chemistry, mechanics, adsorption, biology, microelectronics, sensors. Group: Mxene materials. 99%, Co doping amount 1%. | |
| Co-doped Ti2CTx Multilayer Mxene | Co-doped Ti2CTx Multilayer Mxene. Uses: Energy storage, catalysis, analytical chemistry, mechanics, adsorption, biology, microelectronics, sensors. Group: Mxene materials. 99%, Co doping amount 1%. | |
| Co-doped Ti3C2Tx Multilayer Mxene | Co-doped Ti3C2Tx Multilayer Mxene. Uses: Energy storage, catalysis, analytical chemistry, mechanics, adsorption, biology, microelectronics, sensors. Group: Mxene materials. 99%, Co doping amount 1%. | |
| CoFe2O4 | CoFe2O4. Group: Nanopowder compounds. 98%. | |
| Colored Polystyrene Particles | Colored Polystyrene Particles. Group: Polystyrene (ps). | |
| Conductive Carbon Black Nanoparticles Water Dispersion | Conductive Carbon Black Nanoparticles Water Dispersion. Group: Cnt nano dispersion. CAS No. 1333-86-4. Molecular formula: 12.01 g/mol. 99.9%. | |
| Conductive Carbon Black Nanoparticles Water Dispersion | Conductive Carbon Black Nanoparticles Water Dispersion. Group: Cnt nano dispersion. CAS No. 7440-44-0. Molecular formula: 12.0107 g/mol. 99.99%. | |
| Conductivity Standard at 25 ºC at 100 μmhos in H2O | Conductivity Standard at 25 ºC at 100 μmhos in H2O. Group: Solvents. | |
| COOH functionalized Carbon Nanotube | COOH functionalized Carbon Nanotube. Group: Multi wall cnt. CAS No. 308068-56-6. >90wt% (MWNT). | |
| COOH Functionalized CNT | COOH Functionalized CNT. Group: Multi wall cnt. CAS No. 308068-56-6. 99.9wt% (MWNT) (TGA). | |
| COOH Functionalized CNTs >90%, OD: 50-80nm / Carbon Nanotubes | COOH Functionalized CNTs >90%, OD: 50-80nm / Carbon Nanotubes. Group: Multi wall cnt. Carbon nanotubes > 90wt%. | |
| COOH Functionalized, CNTs >90%, OD: 8-15nm / Carbon Nanotubes | COOH Functionalized, CNTs >90%, OD: 8-15nm / Carbon Nanotubes. Group: Multi wall cnt. Carbon nanotubes > 90wt%. | |
| COOH Functionalized DWCNTs, Purity >60% | COOH Functionalized DWCNTs, Purity >60%. Group: Double wall cnt. Carbon nanotubes > 90wt%. | |
| COOH Functionalized Graphitized MWCNTs | COOH Functionalized Graphitized MWCNTs. Group: Multi wall cnt. Carbon nanotubes > 99.9wt%. | |
| COOH Functionalized High Purified SWCNTs, 98% | COOH Functionalized High Purified SWCNTs, 98%. Group: Single wall cnt. Carbon nanotubes > 98 wt%. | |
| COOH Functionalized MWCNT | COOH Functionalized MWCNT. Group: Multi wall cnt. CAS No. 308068-56-6. >99wt% (MWNT). | |
| COOH Functionalized MWCNTs | COOH Functionalized MWCNTs. Group: Multi wall cnt. Carbon nanotubes > 95wt%. | |
| COOH Functionalized Short DWCNTs, Purity >60% | COOH Functionalized Short DWCNTs, Purity >60%. Group: Double wall cnt. Carbon nanotubes > 90wt%. | |
| COOH Functionalized Short MWCNTs | COOH Functionalized Short MWCNTs. Group: Multi wall cnt. Carbon nanotubes > 95wt%. | |
| COOH Functionalized Short SWCNTs, Purity >90% | COOH Functionalized Short SWCNTs, Purity >90%. Group: Single wall cnt. Carbon nanotubes > 95wt%. | |
| Copper Aluminum (Cu-Al) Alloy Sputtering Targets | Copper Aluminum (Cu-Al) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Aluminum (Cu-Al) Alloy Sputtering Targets, Cu-Al Alloy Sputtering Target, Cu-Al Alloy Sputter Target, Cu-Al Alloy Target, Copper Aluminum Alloy Sputtering Target, Copper Aluminum Alloy Sputter Target, Copper Aluminum Alloy Target. 99.99%. | |
| Copper Aluminum Oxide (CuAlO2) Sputtering Targets | Copper Aluminum Oxide (CuAlO2) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Aluminum Oxide (CuAlO2) Sputtering Targets, CuAlO2 Sputtering Target, CuAlO2 Sputter Target, CuAlO2 Target, Copper Aluminum Oxide Sputtering Target, Copper Aluminum Oxide Sputter Target, Copper Aluminum Oxide Target. CAS No. 25617-97-4. 99.9%. | |
| Copper Bromide | Copper Bromide. Group: other nano materials. CAS No. 7787-70-4. Molecular formula: 143.45g/mol. Mole weight: CuBr. 99.9%. | |
| Copper Carbon-Coated nanoparticles | Copper Carbon-Coated nanoparticles. Group: Compounds nanoparticles. | |
| Copper Carbon Nanotubes | Copper Carbon (Graphite) Nanotubes are generally immediately available in most volumes. Group: Nanotubes other nano materials. Alternative Names: Copper-graphite composite nanotubes, copper-coated CNTs, Cu-C NTs. Mole weight: Cu-C. 99%|99.9%|99.99%|99.999%. | |
| Copper Chromium Alloy Nanopowder | Copper Chromium Alloy Nanopowder. Group: Alloys nanopowders. Mole weight: Cu:Cr. 99.9%. | |
| Copper Chromium Oxide Dispersion | Copper Chromium Oxide Dispersion. Group: Oxide nano dispersion. Mole weight: Cu: CrO2. 99.9%. | |
| Copper CNT Nano Composite | Copper CNT Nano Composite. Group: Graphene nanopowders. Mole weight: Cu/CNT. 99%. | |
| Copper coated Carbon Nanotubes | Copper coated Carbon Nanotubes. Group: Metal and metal oxide nanoparticles coated cnt. | |
| Copper Cobalt (Cu-Co) Alloy Sputtering Targets | Copper Cobalt (Cu-Co) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Cobalt (Cu-Co) Alloy Sputtering Targets, Cu-Co Alloy Sputtering Target, Cu-Co Alloy Sputter Target, Cu-Co Alloy Target, Copper Cobalt Alloy Sputtering Target, Copper Cobalt Alloy Sputter Target, Copper Cobalt Alloy Target. CAS No. 12024-21-4. 99.95%. | |
| Copper Colour Powder | Copper Colour Powder. Group: other nano materials. >99%. | |
| Copper Copper Oxide Core Shell Nanoparticles | Copper Copper Oxide Core Shell Nanoparticles. Group: Core shell nanoparticles. 99.9%. | |
| Copper (Cu) | Copper (Cu). Group: Magnetic nanoparticles. Alternative Names: High Purity Copper (Cu); 99.99% Copper (Cu); 99.999% Copper (Cu); 99.9999% Copper (Cu). 4N-6N. | |
| Copper (Cu) Evaporation Material | Copper (Cu) Evaporation Material. Group: Magnetic nanoparticles. Alternative Names: Cu Pellets, Cu Wire, Cu Pieces, Copper Pellets, Copper Wire, Copper Pieces, Copper Evaporation Material, Cu Evaporation Material, Cu Evapor Materials, Copper Evapor Materials. 99.99%. | |
| Copper (Cu) Sputtering Targets | Copper (Cu) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper (Cu) Sputtering Targets, Cu Sputtering Target, Cu Sputter Target, Cu Target, Copper Sputtering Target, Copper Sputter Target, Copper Target. CAS No. 12024-10-1. 99.99%-99.999%. | |
| Copper Foam-120PPI/1mm as heat absorbing materials | Copper Foam-120PPI/1mm as heat absorbing materials. Group: Metal foams. ≥99.8%. | |
| Copper Foam Heat Exchanger-50PPI/3mm | Copper Foam Heat Exchanger-50PPI/3mm. Group: Metal foams. ≥99.8%. | |
| Copper Foil | Copper Foil. Group: Metal foils. CAS No. 7440-50-8. ≥99.8%. | |
| Copper Foil Roll | Copper Foil Roll. Group: Metal foils. CAS No. 7440-50-8. ≥99.8%. | |
| Copper Foils | Copper Foils. Group: Metal foils. CAS No. 7440-50-8. ≥99.8%. | |
| Copper Foil Sheet Roll | Copper Foil Sheet Roll. Group: Metal foils. CAS No. 7440-50-8. ≥99.8%. | |
| Copper Foil Sheets | Copper Foil Sheets. Group: Metal foils. CAS No. 7440-50-8. ≥99.8%. | |
| Copper Gallium (Cu-Ga) Alloy Sputtering Targets | Copper Gallium (Cu-Ga) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Gallium (Cu-Ga) Alloy Sputtering Targets, Cu-Ga Alloy Sputtering Target, Cu-Ga Alloy Sputter Target, Cu-Ga Alloy Target, Copper Gallium Alloy Sputtering Target, Copper Gallium Alloy Sputter Target, Copper Gallium Alloy Target. 99.99%. | |
| Copper Gallium Oxide Nanoplatelets | Copper Gallium Oxide Nanoplatelets. Group: Oxides nanoparticles. 99.9%. | |
| Copper Germanium (Cu-Ge) Alloy Sputtering Targets | Copper Germanium (Cu-Ge) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Germanium (Cu-Ge) Alloy Sputtering Targets, Cu-Ge Alloy Sputtering Target, Cu-Ge Alloy Sputter Target, Cu-Ge Alloy Target, Copper Germanium Alloy Sputtering Target, Copper Germanium Alloy Sputter Target, Copper Germanium Alloy Target. CAS No. 12025-32-0. 99.9%-99.999%. | |
| Copper(I) Acetate | Copper(I) Acetate. Group: Solution deposition precursors. Alternative Names: Acetic acid copper(I). CAS No. 598-54-9. Pack Sizes: 1, 10 g in glass bottle. Product ID: Copper(1+); acetate. Molecular formula: 122.59. Mole weight: CuCO2CH3. CC(=O)[O-].[Cu+]. InChI=1S/C2H4O2.Cu/c1-2(3)4;/h1H3, (H, 3, 4);/q;+1/p-1. RFKZUAOAYVHBOY-UHFFFAOYSA-M. 95%+. | |
| Copper(I) bromide | Copper(I) bromide. Uses: Copper bromide is also known as cupric bromide, this substance was made by double decomposition when mixing aqueous solutions of copper sulfate and potassium bromide. this greenish blue solution was used as the bleaching step for intensifying collodion and gelatin negatives. Group: Electrolytes. Alternative Names: Cuprous bromide. CAS No. 7787-70-4. Product ID: Bromocopper. Molecular formula: 143.45. Mole weight: CuBr. [Cu]Br. InChI=1S/BrH.Cu/h1H;/q;+1/p-1. NKNDPYCGAZPOFS-UHFFFAOYSA-M. 99%+. | |
| Copper(I) bromide dimethyl sulfide complex | Copper(I) bromide dimethyl sulfide complex. Uses: Copper(I) bromide-dimethyl sulfide can be used as catalyst for adding grignard reagents to fullerenes. Group: Electrolytes. Alternative Names: MFCD00043295; Bromo(dimethylsulfide) copper(I); copper (I) bromide dimethyl sulfide; CTK3J3229; Copper (I) bromide-dimethyl sulfide; AC1MC4I3; DTXSID80203133; ACN-050827; AKOS024437942; CuBr.Me2S. CAS No. 54678-23-8. Product ID: bromocopper; methylsulfanylmethane. Molecular formula: 205.58g/mol. Mole weight: C2H6BrCuS. CSC.[Cu]Br. InChI=1S/C2H6S.BrH.Cu/c1-3-2; ; /h1-2H3; 1H; /q; ; +1/p-1. PMHQVHHXPFUNSP-UHFFFAOYSA-M. | |
| Copper(II) 2-ethylhexanoate | Copper(II) 2-ethylhexanoate. Uses: Wood preservative, anti-fungal. Group: Solution deposition precursors. Alternative Names: Copper bis(2-ethylhexanoate). CAS No. 149-11-1. Product ID: copper; 2-ethylhexanoate. Molecular formula: 349.95. Mole weight: C16H30CuO4. CCCCC(CC)C(=O)[O-]. CCCCC(CC)C(=O)[O-]. [Cu+2]. InChI=1S/2C8H16O2. Cu/c2*1-3-5-6-7(4-2)8(9)10; /h2*7H, 3-6H2, 1-2H3, (H, 9, 10); /q; +2/p-2. SEKCXMNFUDONGJ-UHFFFAOYSA-L. | |
| Copper(II) Acetate Monohydrate | Copper(II) Acetate Monohydrate. Uses: Cupric acetate monohydrate can be used in preparation of fehling's reagent for sugars. Group: Magnetic metal complexessolution deposition precursors. Alternative Names: ANW-33508; Cu(OAc)2 H2O; SC-81521; Copper(2+) acetate, monohydrate; NWFNSTOSIVLCJA-UHFFFAOYSA-L; DTXSID90209202; RTR-032126; ING0003985; AC1L4WMU; Copper(II) acetate monohydrate, ACS reagent. CAS No. 6046-93-1. Product ID: copper; diacetate; hydrate. Molecular formula: 199.649g/mol. Mole weight: C4H8CuO5. CC(=O)[O-].CC(=O)[O-].O.[Cu+2]. InChI=1S/2C2H4O2.Cu.H2O/c2*1-2(3)4; ; /h2*1H3, (H, 3, 4); ; 1H2/q; ; +2; /p-2. NWFNSTOSIVLCJA-UHFFFAOYSA-L. | |
| Copper(II) bromide | Copper bromide may be used as a catalyst in organic reactions and as a brominating agent. Copper catalyzed biotinylation of acetylene terminated poly(ethylene glycol) methyl ether methylacrylate (PEGMEMA) chains has been investigated. Copper dibromide in acetonitrile acts as a catalyst in the interconversion of acetals to bis(methoxyphenyl)methyl (BMPM) ethers. It has been used as a catalyst in the intramolecular decarboxylative functionalization of α-carbonyl to yield a C(sp(3))-O bond for the synthesis of furo[3,2-c]coumarins. Poly(3,4-ethylene dioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) has been reportedly doped with CuBr2 to act as hole transport layer (HTL) in polymer solar cells(PSCs). Doping increase the conductivity and thereby increasing the device power conversion efficiency of PSCs. Uses: As intensifier in photography; as brominating agent in organic synthesis; as humidity indicator; as wood preservative; in solid-electrolyte battery; as stabilizer for acetylated polyformaldehyde. Group: Electrolytes. Alternative Names: Cupric bromide. CAS No. 7789-45-9. Product ID: Dibromocopper. Molecular formula: 223.35. Mole weight: Br2Cu. [Cu](Br)Br. InChI=1S/2BrH.Cu/h2*1H;/q;+2/p-2. QTMDXZNDVAMKGV-UHFFFAOYSA-L. 99%+. | |
| Copper(II) chloride dihydrate | Copper(II) chloride dihydrate. Group: Electrolytes. Alternative Names: CUPRIC CHLORIDE, ACS; Copper(II) chloride dihydrate, 99+%, ACS reagent; Copper(II) chloride dihydrate, 99%, extra pure, powder; Copper (II) Chloride Dihydrate; Cupric chloride (TN); Coppertrace; dichlorocopper dihydrate; Copper(II) chloride dihydrate, 99+%, for analysis; Copper(II) chloride dihydrate, powder, BioReagent, suitable for cell culture; cupric chloride.2H2O. CAS No. 10125-13-0. Product ID: dichlorocopper; dihydrate. Molecular formula: 170.476g/mol. Mole weight: Cl2CuH4O2. O.O.Cl[Cu]Cl. InChI=1S/2ClH.Cu.2H2O/h2*1H; ; 2*1H2/q; ; +2; ; /p-2. MPTQRFCYZCXJFQ-UHFFFAOYSA-L. | |
| Copper(I) iodide | Copper(I) iodide. Uses: Copper catalyst/base admixture useful for screening reactions involving the n-arylation of nitrogen-containing heterocycles. Group: Electrolytes. Alternative Names: Iodocopper. CAS No. 7681-65-4. Molecular formula: 190.45. Mole weight: CuI. [Cu]I. InChI=1S/Cu.HI/h;1H/q+1;/p-1. LSXDOTMGLUJQCM-UHFFFAOYSA-M. 99%. | |
| Copper(I) Iodide (CuI) | Copper(I) Iodide (CuI). Group: Alloys nanopowders. Alternative Names: Cuprous Iodide; Copper(I) Iodide. 99.99%. | |
| Copper(II) sulfate pentahydrate | Copper(II) sulfate pentahydrate. Uses: Anhydr salt for detecting and removing trace amounts of water from alcohols and other organic compounds; as fungicide. pentahydrate as agricultural fungicide, algicide, bactericide, herbicide; food and fertilizer additive; in insecticide mixtures; in manufacture of other cu salts; as mordant in textile dyeing; in preparation of azo dyes; in preserving hides; in tanning leather; in preserving wood; in electroplating solutions; as battery electrolyte; in laundry and metal-marking inks; in petroleum refining; as flotation agent; pigment in paints, varnishes and other materials; in mordant baths for intensifying photographic negatives; in pyrotechnic compositions; in water-resistant adhesives for wood; in metal coloring and tinting baths; in antirusting compositions for radiator and heating systems; as reagent toner in photography and photoengraving; etc. Group: Electrolytesphosphors - phosphor materials. Alternative Names: Chromouschloride. CAS No. 7758-99-8. Product ID: copper; sulfate; pentahydrate. Molecular formula: 249.69. Mole weight: CuSO4 · 5H2O. O.O.O.O.O.[O-]S(=O)(=O)[O-].[Cu+2]. InChI=1S/Cu.H2O4S.5H2O/c;1-5(2, 3)4;;;;;/h;(H2, 1, 2, 3, 4);5*1H2/q+2;;;;;;/p-2. JZCCFEFSEZPSOG-UHFFFAOYSA-L. ≥99%. | |
| Copper(II) tartrate hydrate | Copper(II) tartrate hydrate. Group: Electrolytes. Alternative Names: Cupric tartrate hydrate; Tartaric acid cupric salt; 946843-80-7; DTXSID50746608; Copper(2+) (2R,3R)-2,3-dihydroxybutanedioate--water (1/1/1); Copper(II) tartrate hydrate, >=95.0% (calc. on dry substance, RT). CAS No. 946843-80-7. Product ID: copper; (2R,3R)-2,3-dihydroxybutanedioate; hydrate. Molecular formula: 229.631g/mol. Mole weight: C4H6CuO7. C(C(C(=O)[O-])O)(C(=O)[O-])O. O. [Cu+2]. InChI=1S/C4H6O6. Cu. H2O/c5-1(3(7)8)2(6)4(9)10; ; /h1-2, 5-6H, (H, 7, 8)(H, 9, 10); ; 1H2/q; +2; /p-2/t1-, 2-; ; /m1. /s1. MAUZTCHAIPUZJB-OLXYHTOASA-L. | |
| Copper(II) Tetrafluoroborate (ca. 45% in Water) | Copper(II) Tetrafluoroborate (ca. 45% in Water). Uses: Copper(II) borofluoride is used primarily in the circuit board industry and in copper plating. Group: Metal organic frameworks (mofs). Alternative Names: Copper(II) tetrafluoroborate(45% in H2O); ST2412746; Copper tetrafluoroborate; 14735-84-3; EINECS 253-959-4; Copper(II) Tetrafluoroborate; Borate(1-), tetrafluoro-, copper(2+) (2:1); FT-0659273; Cupric fluoroborate; FT-0624059. CAS No. 38465-60-0. Product ID: copper; ditetrafluoroborate. Molecular formula: 237.153g/mol. Mole weight: B2CuF8. [B-](F)(F)(F)F. [B-](F)(F)(F)F. [Cu+2]. InChI=1S/2BF4.Cu/c2*2-1(3, 4)5;/q2*-1;+2. HMUNZEYTSRPVBE-UHFFFAOYSA-N. | |
| Copper Indium Gallium (CIG) Sputtering Targets | Copper Indium Gallium (CIG) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Indium Gallium (CIG) Sputtering Targets, CuInGa Sputtering Target, CIG Sputtering Target, CIG Sputter Target, CIG Target, Copper Indium Gallium Sputtering Target, Copper Indium Gallium Sputter Target, Copper Indium Gallium Target. 99.99%. | |
| Copper Indium Gallium Selenide (CIGS) | Copper Indium Gallium Selenide (CIGS). Group: Alloys nanopowders. Alternative Names: Copper Indium Gallium Selenide (CIGS) Powder, CIGS Powder, Copper Indium Gallium Selenide (CIGS), CuInGaSe (CIGS), CuIn0.7Ga0.3Se2, CuIn0.5Ga0.5Se2. [99.99%]. | |
| Copper Indium Gallium Selenide (CIGS) Sputtering Targets | Copper Indium Gallium Selenide (CIGS) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Indium Gallium Selenide (CIGS) Sputtering Targets, CuInGaSe (CIGS) Sputtering Target, CuIn0.7Ga0.3Se2 Sputtering Target, CIGS Sputtering Target, CIGS Sputter Target, CIGS Target, Copper Indium Gallium Selenide Sputtering Target. CAS No. 12064-03-8. 99.99%. | |
| Copper Indium Gallium Selenide Nanoparticles | Copper Indium Gallium Selenide Nanoparticles. Group: Nanopowder compounds. CAS No. 12018-5-0. Mole weight: CuInxGa(1-x)Se2. 99.9%. | |
| Copper Indium Selenide (CuInSe2) Sputtering Targets | Copper Indium Selenide (CuInSe2) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Indium Selenide (CuInSe2) Sputtering Targets, CuInSe2(CIS) Sputtering Target, CuInSe2 Sputtering Target, CuInSe2 Sputter Target, CuInSe2 Target, Copper Indium Selenide Sputtering Target, Copper Indium Selenide Sputter Target. 99.99%. | |
| Copper Indium Sulfide Zinc Sulfide Quantum Dots | Copper Indium Sulfide Zinc Sulfide Quantum Dots. Group: other quantum dots. | |
| Copper Indium Sulfide Zinc Sulfide Quantum Dots In Water | Copper Indium Sulfide Zinc Sulfide Quantum Dots In Water. Group: other quantum dots. | |
| Copper(I) Oxide Nanospheres | Copper(I) Oxide Nanospheres. Group: Nanospheres. Product ID: copper; oxocopper. Molecular formula: 143.09. O=[Cu].[Cu]. | |
| Copper(I) Selenide (Cu2Se) | Copper(I) Selenide (Cu2Se). Group: Alloys nanopowders. Alternative Names: Copper(I) Selenide Powder, Cu2Se Powder, Copper(I) Selenide; Cu2Se. 99.9%-99.99%. | |
| Copper(I) Telluride (Cu2Te) | Copper(I) Telluride (Cu2Te). Group: Alloys nanopowders. Alternative Names: Copper(I) Telluride Powder, Cu2Te Powder, Copper(I) Telluride; Cu2Te. 99.9%-99.99%. | |
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