Alfa Chemistry Materials 3 - Products
Alfa Chemistry Materials is specialized in material chemistry and offers an extensive catalog of materials in a wide range of applications, including Metals and Materials, 3D Printing Materials, Biomaterials.
| Product | Description | |
|---|---|---|
| Copper Metal Foam | Copper Metal Foam. Group: Metal foams. ≥99.8%. |  |
| Copper Nanoparticles | Copper Nanoparticles. Group: Elements nanoparticlesmetal nano dispersion. 99.9%+. | |
| Copper nanopowder | Copper nanopowder. Group: Nanofibers. 99.9% (metal basis). | |
| Copper nano Powder | Copper nano Powder. Group: Metal nano dispersion. 0.998. | |
| Copper Nanorods | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanorods. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanotubes | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanotubes. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanowire | Copper Nanowire. Group: Nanowires. ≥96.5. | |
| Copper nanowire dispersion (20nm) | Copper nanowire dispersion (20nm). Group: Nanowires. | |
| Copper nanowire dispersion (40nm) | Copper nanowire dispersion (40nm). Group: Nanowires. | |
| Copper nanowires | Copper nanowires. Group: Nanowires. ≥ 96.5 %. | |
| Copper Nanowires | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanowires. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. > 99.99%. | |
| Copper nanowires 100nm*10um | Copper nanowires 100nm*10um. Group: Nanowires. | |
| Copper Nanowires, 40-50 nm | Copper Nanowires, 40-50 nm. Group: other s. | |
| Copper Nickel Alloy nanoparticles | Copper Nickel Alloy nanoparticles. Group: Compounds nanoparticles. | |
| Copper Nickel Alloy Nanopowder | Copper Nickel Alloy Nanopowder. Group: Alloys nanopowders. Mole weight: Cu/Ni. 99.9%. | |
| Copper Nickel Cu-Ni Alloy Powder | Copper Nickel Cu-Ni Alloy Powder. Uses: Manufacture multi-layer ceramic capacitor terminals and internal electrodes, electronic components, electronic paste, etc. Group: Alloy powders. >99.5%. | |
| Copper Nickel (Cu-Ni) Alloy Sputtering Targets | Copper Nickel (Cu-Ni) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Nickel (Cu-Ni) Alloy Sputtering Targets, Cu-Ni Alloy Sputtering Target, Cu-Ni Alloy Sputter Target, Cu-Ni Alloy Target, Copper Nickel Alloy Sputtering Target, Copper Nickel Alloy Sputter Target, Copper Nickel Alloy Target. CAS No. 12064-62-9. 99.95%. | |
| Copper Nickel Foil | Copper Nickel Foil. Group: Metal foils. CAS No. 471-34-1. ≥99.9%. | |
| Copper No.1 Etchant | Copper & Brass (nitric acid and DI water). Group: Etchants. | |
| Copper No.2 Etchant | Copper & Brass (HCl and ferric chloride). Group: Etchants. | |
| Copper Oxide Aluminium Core Shell | Copper Oxide Aluminium Core Shell. Group: Core shell nanoparticles. 99.9%. | |
| Copper Oxide (CuO) | Copper Oxide (CuO). Group: Magnetic nanoparticles. Alternative Names: High Purity Copper Oxide (CuO); 99.99% Copper Oxide (CuO); 99.999% Copper Oxide (CuO); ; high purity copper oxide; high purity copper(II) oxide; high purity cupric oxide. 3N-4N. | |
| Copper Oxide (CuO) Nano Powder | Copper Oxide (CuO) Nano Powder. Group: Oxides nanoparticles. 99.9%. | |
| Copper Oxide (CuO) Sputtering Targets | Copper Oxide (CuO) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Oxide (CuO) Sputtering Targets, CuO Sputtering Target, CuO Sputter Target, CuO Target, Copper Oxide Sputtering Target, Copper Oxide Sputter Target, Copper Oxide Target. 99.7%. | |
| Copper Oxide Dispersion | Copper Oxide Dispersion. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9 %. | |
| Copper Oxide Ink | Copper Oxide Ink. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9%. | |
| Copper oxide nanoparticles | Copper oxide nanoparticles. Group: Oxides nanoparticleselements nanoparticlescompounds nanoparticles. >99.9%. | |
| Copper Oxide Nanoparticles (CuO) | Copper Oxide Nanoparticles (CuO). Group: Elements nanoparticles. 99+ %. | |
| Copper Oxide Nanoparticles Dispersion | Copper Oxide Nanoparticles Dispersion. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9%. | |
| Copper Oxide NanoPowder | Copper Oxide NanoPowder. Group: Nanofibers. >99.95+%. | |
| Copper Oxide Nanorods | Copper Oxide Nanorods. Group: Nanorods. 99.5+%. | |
| Copper Palladium Silicon (Cu-Pd-Si) Alloy Sputtering Targets | Copper Palladium Silicon (Cu-Pd-Si) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Palladium Silicon (Cu-Pd-Si) Alloy Sputtering Targets, Alloy (Pd77.5Cu6Si16.5 at%) Sputtering Target, Cu-Pd-Si Alloy Sputtering Target, Cu-Pd-Si Alloy Sputter Target, Cu-Pd-Si Alloy Target, Copper Palladium Silicon Alloy Sputtering Target. 99.95%. | |
| Copper Selenide (Cu2Se) Sputtering Targets | Copper Selenide (Cu2Se) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Selenide (Cu2Se) Sputtering Targets, Cu2Se Sputtering Targets, Cu2Se Targets, Cu2Se Sputter Targets. 99.9%-99.99%. | |
| Copper Selenide (CuSe) | Copper Selenide (CuSe). Group: Alloys nanopowders. Alternative Names: Copper Selenide Powder, CuSe Powder, Copper Selenide, CuSe, 1317-41-5. 99.99%, 99.999%. | |
| Copper Selenide (CuSe) Sputtering Targets | Copper Selenide (CuSe) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Selenide (CuSe) Sputtering Targets, CuSe Sputtering Target, CuSe Sputter Target, CuSe Target, Copper Selenide Sputtering Target, Copper Selenide Sputter Target, Copper Selenide Target. CAS No. 12035-52-8. 99.9%. | |
| Copper Shots | Copper Shots. Group: Chips/pellets/metal balls. CAS No. 7440-50-8. Mole weight: Cu. | |
| Copper Silica Core-Shell Nanoparticles | Copper Silica Core-Shell Nanoparticles. Group: Core shell nanoparticles. Mole weight: Cu/SiO2. > >99.99%. | |
| Copper Sulfate Passivation Etchant | Copper & Brass (HCl and ferric chloride). Group: Etchants. | |
| Copper Sulfide (Cu2S) | Copper Sulfide (Cu2S). Group: Alloys nanopowders. Alternative Names: Copper Sulfide Powder, Cu2S Powder, dicopper sulphide; copper(I) sulphide; copper sulfide; copper sulphide; copper(I) sulfide; cuprous sulfide; cuprous sulphide; dicopper sulfide. 99.999%. | |
| Copper Sulfide (Cu2S) Sputtering Targets | Copper Sulfide (Cu2S) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Sulfide (Cu2S) Sputtering Targets, Cu2S Sputtering Targets, Cu2S Targets, Cu2S Sputter Targets. CAS No. 1313-97-9. 99.999%. | |
| Copper Sulfide (CuS) | Copper Sulfide (CuS). Group: Alloys nanopowders. Alternative Names: Copper Sulfide Powder, CuS Powder, Copper Sulfide, CuS, 1317-40-4. 99.9%, 99.99%, 99.999%. | |
| Copper Sulfide (CuS) Sputtering Targets | Copper Sulfide (CuS) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Sulfide (CuS) Sputtering Targets, CuS Sputtering Target, CuS Sputter Target, CuS Target, Copper Sulfide Sputtering Target, Copper Sulfide Sputter Target, Copper Sulfide Target. CAS No. 12007-01-1. 99.9%-99.95%. | |
| Copper Sulfide Sputtering Target | Copper Sulfide Sputtering Target. Group: Sputtering targets. CAS No. 7440-42-8. Molecular formula: 10.81 g/mol. Mole weight: Bo. >99.99%. | |
| Copper Telluride (Cu2Te) Sputtering Targets | Copper Telluride (Cu2Te) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Telluride (Cu2Te) Sputtering Targets, Cu2Te Sputtering Targets, Cu2Te Targets, Cu2Te Sputter Targets. 99.99%-99.999%. | |
| Copper Telluride (CuTe) | Copper Telluride (CuTe). Group: Alloys nanopowders. Alternative Names: Copper Telluride Powder, CuTe Powder, Copper Telluride, CuTe, 12019-23-7. 99.99%, 99.999%. | |
| Copper Tin Alloy nanoparticles | Copper Tin Alloy nanoparticles. Group: Compounds nanoparticles. | |
| Copper Zinc Alloy Nanopowder | Copper Zinc Alloy Nanopowder. Group: Alloys nanopowders. CAS No. 63338-02-3. Molecular formula: 128.9 g/mol. Mole weight: Cu:Zn. 99.9%. | |
| Copper Zinc Alloy Nanoprisms | Copper Zinc Alloy Nanoprisms. Group: Nanoprisms. Molecular formula: 126.86. [Cu].[Zn]. | |
| Copper Zinc (Cu-Zn) Alloy Sputtering Targets | Copper Zinc (Cu-Zn) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Zinc (Cu-Zn) Alloy Sputtering Targets, Cu-Zn Alloy Sputtering Target, Cu-Zn Alloy Sputter Target, Cu-Zn Alloy Target, Copper Zinc Alloy Sputtering Target, Copper Zinc Alloy Sputter Target, Copper Zinc Alloy Target. CAS No. 13709-42-7. 99.9%-99.999%. | |
| Copper Zirconium Alloy Nanopowder | Copper Zirconium Alloy Nanopowder. Group: Alloys nanopowders. Mole weight: Cu:Zr. >99.9%. | |
| Copper Zirconium (Cu-Zr) Alloy Sputtering Targets | Copper Zirconium (Cu-Zr) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Zirconium (Cu-Zr) Alloy Sputtering Targets, Cu-Zr Alloy Sputtering Target, Cu-Zr Alloy Sputter Target, Cu-Zr Alloy Target, Copper Zirconium Alloy Sputtering Target, Copper Zirconium Alloy Sputter Target, Copper Zirconium Alloy Target. 99.95%. | |
| Core-Shell Silica Nanoparticles | Core-Shell Silica Nanoparticles. Group: Compounds nanoparticles. | |
| Co Solvent Polyamide Resin ALFA01 | This product is a low freezing point benzene soluble polyamide resin with good cold resistance (i.e. good resistance to gelation) and indoor temperature frost transfer. The resin has good adhesion to most treated films and is significantly more compatible with NC than other homogeneous products. Uses: This product is is ideal for gravure printing inks. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA02 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: Gravure inks; paper and film printing inks; overprint varnishes. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA03 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: It is used in gravure inks and has excellent adhesion to untreated pe/pp. it also has excellent adhesion to treated pe/pp and aluminum foil. it has wide adaptability as an ink for both untreated and treated pe/pp. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA04 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: Gravure inks; film printing inks. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA05 | This polyamide resin is an alcohol-soluble/co-solvent resin with excellent solvent release and blocking properties. It was developed for mold release paints, but can also be used as a modified resin to improve hardness. Uses: Used in flexographic and heat seal applications. can be used for overprinting lacquers, especially cold seal release lacquers. used as a modifier to improve hardness. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA06 | This resin is an alcohol-soluble/co-solvent resin with excellent solvent release and blocking properties. This polyamide resin was developed for mold release varnishes and has the lowest solution viscosity but fast solvent release. Uses: For flexographic printing, gravure printing and cold seal release varnishes. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA07 | This polyamide resin is an alcohol-soluble/co-solvent type resin with low-temperature gel resistance and good compatibility with modified resins. Uses: Used for flexographic and gravure printing; can be used for overprint lacquers, especially cold seal release lacquers. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA08 | This polyamide resin is an alcohol-soluble/co-solvent type resin with excellent solvent release and blocking properties. Uses: This polyamide resin was developed for mold release varnish. however, it can also be used as a modified resin to improve hardness. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA09 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: Flexo & gravure inks, thixotropic paints. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA10 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: Flexo & gravure inks, thixotropic paints. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA11 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: Flexo & gravure inks, thixotropic paints. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA12 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: Flexo & gravure inks, high gloss liquid inks. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA13 | The polyamide resin is a co-solvent resin that is soluble in alcohols, but usually requires a mixture of aliphatic hydrocarbons and alcohols to achieve gel stability. The polyamide resin provides fast solvent release and good oil resistance in flexographic/gravure inks on plastic substrates and is particularly effective as an overprint lacquer. Uses: For flexographic or gravure printing. can be used for overprinting varnishes, especially cold seal release varnishes can be used for high speed printing inks. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA14 | The polyamide resin is a co-solvent resin that is soluble in alcohols, but usually requires a mixture of aliphatic hydrocarbons and alcohols to achieve gel stability. Uses: Flexographic/gravure inks for plastic substrates. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA15 | Brown beads shape. Uses: For excellent adhesion on hdpe/ldpe substrate. flexo and gravure inks. Group: Co solvent polyamide resins. | |
| CoxZn1-xFe2O4 | CoxZn1-xFe2O4. Group: Nanopowder compounds. 99.5%. | |
| Cr2O3 (60 nm) | Cr2O3 (60 nm). Group: Oxides nanoparticles. >99%. | |
| Cresyl Diphenyl Phosphate, (so called) (mixture of analogue) | Cresyl Diphenyl Phosphate, (so called) (mixture of analogue). Group: Plasticizers. CAS No. 26444-49-5. | |
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