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| Product | Description | |
|---|---|---|
| Boron Nitride Sputtering Target | Boron Nitride Sputtering Target. Group: Sputtering targets. CAS No. 10043-11-5. Molecular formula: 24.82 g/mol. >99.9%. |  |
| Boron nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis) | Boron nitride sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis). Group: Evaporation materials. | |
| Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis) | Boron nitride sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.99% (metals basis). Group: Evaporation materials. | |
| Boron nitride sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis) | Boron nitride sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.99% (metals basis). Group: Evaporation materials. | |
| Boron Nitride (BN) Sputtering Targets | Boron Nitride (BN) Sputtering Targets. Group: Sputtering targets. Alternative Names: Boron Nitride (BN) Sputtering Targets, BN Sputtering Target, BN Sputter Target, BN Target, Boron Nitride Sputtering Target, Boron Nitride Sputter Target, Boron Nitride Target. CAS No. 12070-12-1. 99.5%. | |
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