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| Product | Description | |
|---|---|---|
| Copper Nanorods | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. 99%, 99.9%, 99.99%, 99.999%. |  |
| Copper Nanorods | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanorods. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanorods Properties | Copper Nanorods Properties. Group: Nanorods. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. (99%, 99.9%, 99.99%). | |
| Copper Oxide Nanorods | Copper Oxide Nanorods. Group: Nanorods. 99.5+%. | |
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