Copper Pellets Suppliers USA
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Product | Description | |
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Copper pellets 1/4x1/2 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/4x1/2. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-4. | www.prochemonline.com |
Copper pellets 1/4x1/2 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/4x1/2. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm , 1 kg. Order Number: 1524. | www.prochemonline.com |
Copper pellets 1/4x1/4 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/4x1/4. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-5. | www.prochemonline.com |
Copper pellets 1/4x1/4 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/4x1/4. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-1. | www.prochemonline.com |
Copper pellets 1/8x1/4 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/8x1/4. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm , 1 kg. Order Number: 1524-6. | www.prochemonline.com |
Copper pellets 1/8x1/4 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/8x1/4. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-2. | www.prochemonline.com |
Copper pellets 1/8x1/8 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/8x1/8. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm , 1 kg. Order Number: 1524-3. | www.prochemonline.com |
Copper pellets 1/8x1/8 Quick inquiry Where to buy Suppliers range | Copper, pellets, 1/8x1/8. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-7. | www.prochemonline.com |
Copper (Cu) Evaporation Material Quick inquiry Where to buy Suppliers range | Copper (Cu) Evaporation Material. Alternative Names: Cu Pellets, Cu Wire, Cu Pieces, Copper Pellets, Copper Wire, Copper Pieces, Copper Evaporation Material, Cu Evaporation Material, Cu Evapor Materials, Copper Evapor Materials. Grades: 99.99%. Product ID: ACMA00019125. | |
Copper gauze, 100 mesh woven from 0.11mm (0.0045in) dia wire Quick inquiry Where to buy Suppliers range | Copper gauze, 100 mesh woven from 0.11mm (0.0045in) dia wire. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper gauze, 10 mesh woven from 0.15mm (0.006in) dia wire Quick inquiry Where to buy Suppliers range | Copper gauze, 10 mesh woven from 0.15mm (0.006in) dia wire. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper gauze, 140 mesh woven from 0.056mm (0.0022in) dia wire Quick inquiry Where to buy Suppliers range | Copper gauze, 140 mesh woven from 0.056mm (0.0022in) dia wire. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper gauze, 30 mesh woven from 0.15mm (0.006in) dia wire Quick inquiry Where to buy Suppliers range | Copper gauze, 30 mesh woven from 0.15mm (0.006in) dia wire. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper gauze, 80 mesh woven from 0.14mm (0.0055in) dia wire Quick inquiry Where to buy Suppliers range | Copper gauze, 80 mesh woven from 0.14mm (0.0055in) dia wire. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper(II) sulfate Quick inquiry Where to buy Suppliers range | Copper(II) sulfate. Uses: Cupric sulfate appears as a white or off-white solid. Melting point 200? with decomposition. Non-combustible.;DryPowder; DryPowder, PelletsLargeCrystals; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals;WHITE HYGROSCOPIC CRYSTALS. Group: Electrolytes; Phosphors - Phosphor Materials. CAS No. 7758-98-7. IUPAC Name: copper;sulfate. Molecular Weight: 159.61g/mol. Molecular Formula: CuSO4;CuSO4;CuO4S. SMILES: [O-]S(=O)(=O)[O-].[Cu+2]. InChI: InChI=1S/Cu.H2O4S/c;1-5(2,3)4/h;(H2,1,2,3,4)/q+2;/p-2. InChIKey: ARUVKPQLZAKDPS-UHFFFAOYSA-L. Boiling Point: 650 ? (decomp to cupric oxide). Melting Point: 590 ? decomp. Density: 2.29 at 59 °F (USCG, 1999);3.6;3.6 g/cm³. Solubility: Very soluble in hot water, soluble cold water;Soluble in methanol (1.1 g/100 ml), but insoluble in ethanol; it readily dissolves in aqueous ammonia and excess alkali metal cyanides, with the formation of complexes;In water, 243 g/l @ 0 ?.;75.4 g/100 cc water @ 100 ?;1.04 g/100 cc methanol @ 18 ?;Solubility in water, g/100ml at 20 ?: 20.3. | |
Copper Nanofoil Quick inquiry Where to buy Suppliers range | Reddish Metal. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Purity: 99.9%, 99.99%, 99.999%. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper Nanorods Quick inquiry Where to buy Suppliers range | Reddish Metal. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 2562°C. Melting Point: 1085°C. Purity: 99%, 99.9%, 99.99%, 99.999%. Density: 8.96 g/cm³. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper Nanotubes Quick inquiry Where to buy Suppliers range | Reddish Metal. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 2562°C. Melting Point: 1085°C. Purity: 99%, 99.9%, 99.99%, 99.999%. Density: 8.96 g/cm³. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper Nanowires Quick inquiry Where to buy Suppliers range | Reddish Metal. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 2562°C. Melting Point: 1085°C. Purity: > 99.99%. Density: 8.96 g/cm³. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper plate, Oxygen-Free High Conductivity (OFHC), alloy 101, 6.35mm (0.25in) thick Quick inquiry Where to buy Suppliers range | Copper plate, Oxygen-Free High Conductivity (OFHC), alloy 101, 6.35mm (0.25in) thick. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Alloys. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper rod, Oxygen-Free High Conductivity (OFHC), alloy 101, 3.175mm (0.125in) dia Quick inquiry Where to buy Suppliers range | Copper rod, Oxygen-Free High Conductivity (OFHC), alloy 101, 3.175mm (0.125in) dia. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Alloys. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper rod, Oxygen-Free High Conductivity (OFHC), alloy 101, 6.35mm (0.25in) dia Quick inquiry Where to buy Suppliers range | Copper rod, Oxygen-Free High Conductivity (OFHC), alloy 101, 6.35mm (0.25in) dia. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Alloys. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper rod, Oxygen-Free High Conductivity (OFHC), alloy 101, 9.53mm (0.375in) dia Quick inquiry Where to buy Suppliers range | Copper rod, Oxygen-Free High Conductivity (OFHC), alloy 101, 9.53mm (0.375in) dia. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Alloys. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper single crystal, 15mm (0.59in) dia, 50mm (2.0in) long, (100) orientation Quick inquiry Where to buy Suppliers range | Copper single crystal, 15mm (0.59in) dia, 50mm (2.0in) long, (100) orientation. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Evaporation Materials; Single Crystals; Nanowires. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper single crystal, 15mm (0.59in) dia, 50mm (2.0in) long, (110) orientation, ±2° Quick inquiry Where to buy Suppliers range | Black-Brown. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Evaporation Materials; Single Crystals; Nanopowders. Alternative Names: Copper OFC. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Purity: 99%, 99.9%, 99.99%, 99.999%. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper single crystal, 15mm (0.59in) dia, 50mm (2.0in) long, (111) orientation Quick inquiry Where to buy Suppliers range | Liquid dispersion. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Evaporation Materials; Single Crystals. Alternative Names: Copper nanoparticle suspension. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper single crystal, 15mm (0.59in) dia, 50mm (2.0in) long, random orientation Quick inquiry Where to buy Suppliers range | Liquid dispersion. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Evaporation Materials; Single Crystals. Alternative Names: Copper nanowire suspension. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper single crystal disc, 10mm (0.39in) dia, 1-3mm (0.04-0.1in) thick, (100) orientation Quick inquiry Where to buy Suppliers range | Red dispersion. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: 3D Printing Materials; Evaporation Materials; Single Crystals. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Purity: ≥99.0%. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper single crystal disc, 10mm (0.39in) dia, 1-3mm (0.04-0.1in) thick, (110) orientation Quick inquiry Where to buy Suppliers range | Red dispersion. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Evaporation Materials; Single Crystals; Vapor Deposition Precursors. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Purity: ≥96.5. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper single crystal disc, 10mm (0.39in) dia, 1-3mm (0.04-0.1in) thick, (111) orientation Quick inquiry Where to buy Suppliers range | Red. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Evaporation Materials; Single Crystals; Nanoparticles. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, 99.995% (metals basis) Quick inquiry Where to buy Suppliers range | Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, 99.995% (metals basis). Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, 99.995+% (metals basis), Oxygen free Quick inquiry Where to buy Suppliers range | Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, 99.995+% (metals basis), Oxygen free. Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, 99.996% (metals basis) Quick inquiry Where to buy Suppliers range | Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, 99.996% (metals basis). Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.996% (metals basis) Quick inquiry Where to buy Suppliers range | Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.996% (metals basis). Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.99% (metals basis) Quick inquiry Where to buy Suppliers range | Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.99% (metals basis). Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis) Quick inquiry Where to buy Suppliers range | Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis). Uses: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Alloys. CAS No. 7440-50-8. IUPAC Name: copper. Molecular Weight: 63.55g/mol. Molecular Formula: Cu. SMILES: [Cu]. InChI: InChI=1S/Cu. InChIKey: RYGMFSIKBFXOCR-UHFFFAOYSA-N. Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 ?;2595 ?;4703°F;4703°F. Melting Point: 1981 °F (NIOSH, 2016);1083 ?;1083 ?;1981°F;1981°F. Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94. Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble. | |
Dicyandiamide Quick inquiry Where to buy Suppliers range | DryPowder; Liquid; OtherSolid; PelletsLargeCrystals;WHITE CRYSTALLINE POWDER. Uses: Dicyandiamide is used in the production of special resins, flame retardants, guanidine salts, etc., used as fillers in artificial leather, and used as a curing agent on adhesives. The printing and dyeing industry use dicyandiamide to manufacture fixing agents. The leather industry use it to make leather retanning agents. Water treatment industry use it to make decolorant or flocculant. It can be used in electroplating and manufacturing steel surface hardener. It can also be used as fertilizer nitrification inhibitor in agriculture. Electronic grade dicyandiamide is mainly used for epoxy resin curing agents in the manufacture of copper clad laminates for the electronic information industry, inner coating films for food and beverage metal packaging, high-grade non-toxic flame retardants, additives for food plastics, special pharmaceutical intermediates. Group: Nitrogen Flame Retardant. Grades: 99.5%, electronic grade 99.7%. CAS No. 461-58-5. Product ID: ACM461585. Molecular formula: C2H4N4. Mole weight: 84.08. IUPAC Name: 2-cyanoguanidine. Appearance: White crystal. Density: 1.400 @ 25 °C/4 °C;1.4 g/cm³. SMILES: NC(=N)NC#N. |