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| Product | Description | |
|---|---|---|
| Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99% | Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%. Group: Alloys. |  |
| Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99% | Tungsten wire, gold plated, 0.05mm (0.002in) dia, W 99.95% (metals basis), Au 99.99%. Group: Alloys. | |
| Chloroauric acid | Chlorine acid is mainly used for alkaloid determination, electroplating gold, photography, gold powder, porcelain coloring, red glass manufacturing, special ink and treatment of tuberculosis. It can also be used as analytical reagent, such as microanalysis of rubidium (Rb) and cesium (Cs). It is used for semiconductor, electronic connector and local gold-plated of integrated circuit lead frame, also for printing circuit boards.The HCl plus the HNO2 (hydrochloric and nitric acids) are combined to produce agua regia acid, which is the only acid that can dissolve gold. Group: Metal & ceramic materials. Alternative Names: Hydrogen tetrachloroaurate(III) solution. CAS No. 16903-35-8. Molecular formula: HAuCl4. Mole weight: 339.79. Appearance: Yellow liquid. Purity: 99%+. Density: 3.9 g/mL at 25 °C (lit.). Catalog: ACM16903358-1. |  |
| Chloroauric acid | Chloroauric acid. Uses: Chlorine acid is mainly used for alkaloid determination, electroplating gold, photography, gold powder, porcelain coloring, red glass manufacturing, special ink and treatment of tuberculosis. it can also be used as analytical reagent, such as microanalysis of rubidium (rb) and cesium (cs). it is used for semiconductor, electronic connector and local gold-plated of integrated circuit lead frame, also for printing circuit boards.the hcl plus the hno2 (hydrochloric and nitric acids) are combined to produce agua regia acid, which is the only acid that can dissolve gold. Group: Electrolytes. Alternative Names: Hydrogen tetrachloroaurate(III) solution. CAS No. 16903-35-8. Molecular formula: 339.79. Mole weight: HAuCl4. 99%+. | |
| Bright electroless gold plating solution | Bright electroless gold plating solution. Group: Electronic materials. | |
| Digold trioxide | Gold plating. Group: Nanoparticles & nanopowders. Alternative Names: gold(3+); Gold(III) oxide, Premion(R); Jsp001842; LW5Y686RUP; Gold oxide (Au2O3); UNII-LW5Y686RUP; Gold trioxide; oxygen(2-). CAS No. 1303-58-8. Molecular formula: Au2O3;Au2O3. Mole weight: 441.93g/mol. IUPACName: gold(3+);oxygen(2-). Canonical SMILES: [O-2].[O-2].[O-2].[Au+3].[Au+3]. ECNumber: 215-122-1. Catalog: ACM1303588. | |
| Sodium Thiosulfate | Sodium Thiosulfate Pentahydrate is a source of Sulfide Ion and a reducing agent. It is water soluable and is commonly used in water treatment to remove chlorine. It is even used in hot packs as an agent in exothermic phase change! Uses: Water Treatment, Chrome Plating, Dechlorination Agent, Photography, Gold Mining. Alternative Names: Hypo, Rice Crystals, Sodium Hyposulfite Pentahydrate, Sodium Thiosulphate Pentahydrate. Grades: Technical. CAS No. 10102-17-7. Pack Sizes: 55 Lb, 50 Lb. |  USA |
| Tetrachloroauric acid | Tetrachloroauric acid is an inorganic compound with the chemical formula H[AuCl 4 ] and can be formed when gold is dissolved in aqua regia. Tetrachloroauric acid can be utilized in gold plating or preparation of gold nanoparticles [1]. Uses: Scientific research. Group: Signaling pathways. CAS No. 16903-35-8. Pack Sizes: 100 mg; 250 mg; 500 mg; 1 g. Product ID: HY-W035091. |  |
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