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| Product | Description | |
|---|---|---|
| Carboxymethyl-dextran sodium salt 10-20% COOH - Average molecular weight 40000 | Cas No. 39422-83-8. |  |
| Carboxymethyl-dextran sodium salt 10-20% COOH - Average molecular weight 70000 | | |
| Carboxymethyl-dextran sodium salt 10-20% COOH terminally reduced - Average molecular weight 40000 | | |
| Carboxymethyl-dextran sodium salt 10-20% COOH terminally reduced - Average molecular weight 70000 | | |
| Carboxymethyl-dextran sodium salt 20-30% COOH - Average molecular weight 40000 | | |
| Carboxymethyl-dextran sodium salt 20-30% COOH - Average molecular weight 70000 | | |
| Chitosan, Low Molecular Weight | Chitosan, Low Molecular Weight. CAS No. 9012-76-4. Product ID: 5-02411. Mole weight: Mw 3,000~10,000. Purity: >97%. |  |
| Chitosan, Low Molecular Weight | Chitosan, Low Molecular Weight. CAS No. 9012-76-4. Product ID: 5-02412. Mole weight: Mw ~10,000. | |
| Chitosan oligomer (Dp 3-7) - Molecular weight 1000 | Chitosan oligomer (Dp 3-7) - Molecular weight 1000 is a chitosan oligomer with a remarkable molecular weight of 1000. From studying inflammation to expediting wound recovery, this masterpiece emerges as the epitome of groundbreaking drug delivery systems. Molecular formula: (C6H11NO4)n. | |
| Cripto, FRL1, Cryptic Family 1 (CFC1) Recombinant, Human, Unstained Protein Molecular Weight Marker | Cripto, FRL1, Cryptic Family 1 (CFC1) Recombinant, Human, Unstained Protein Molecular Weight Marker. Group: Molecular Biology. Grades: Highly Purified. Pack Sizes: 15ul. US Biological Life Sciences. |  Worldwide |
| Deoxyribonucleic acid low molecular weight from salmon sperm | Cas No. 100403-24-5. | |
| High Molecular Weight Polyamide Resin | This polyamide resin is a high molecular weight resin designed to provide laminating inks with a combination of excellent adhesion and viscosity stability. Uses: Laminating ink with superior bonding ability. Group: Alcohol soluble polyamide resins. |  |
| Human Kininogen (Single Chain High Molecular Weight) | High Molecular Weight Kininogen (HK) is a non-enzymatic cofactor of the contact activation system. HK is thought to have two functions in the contact activation system. First, HK links Prekallikrein to a negatively charged surface thereby allowing activation of Kallikrein by surface bound Factor a-XIIa. HK also forms a complex with Factor XI and accelerates its activation to XIa by a-XIIa. Additionally HK serves as a source of Bradykinin, a potent vasoactive peptide important in hypotension studies. The protein purity is determined by SDS-PAGE. Group: Zymogens. Purity: >95% by SDS-PAGE. Kininogen. Mole weight: 120000. Storage: 2-8°C. Source: Human. Human Kininogen (Single Chain High Molecular Weight); Kininogen. Pack: 1mg. Cat No: CZY-028. |  |
| Human Kininogen (Two Chain High Molecular Weight) | ERL offers the two chain Kinin-free form of Kininogen. This is prepared by Kallikrein digestion of Kininogen which is then repurified to remove traces of Kallikrein. Group: Zymogens. Purity: >95% by SDS-PAGE. Kininogen. Mole weight: 110000. Storage: 2-8°C. Source: Human. Human Kininogen (Two Chain High Molecular Weight); Kininogen. Pack: 1mg. Cat No: CZY-029. | |
| Hyaluronate biotin - Molecular Weight - 1000kDa | | |
| Hyaluronate biotin - Molecular Weight - 10kDa | | |
| Hyaluronate biotin - Molecular Weight - 1500kDa | | |
| Hyaluronate biotin - Molecular Weight - 20kDa | | |
| Hyaluronate biotin - Molecular Weight - 2500kDa | | |
| Hyaluronate biotin - Molecular Weight - 250kDa | | |
| Hyaluronate biotin - Molecular Weight - 500kDa | | |
| Hyaluronate biotin - Molecular Weight - 50kDa | | |
| Hyaluronate biotin - Molecular Weight - 750kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 1000kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 10kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 1500kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 20kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 2500kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 250kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 500kDa | | |
| Hyaluronate fluorescein - Molecular Weight - 50kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 1000kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 10kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 1500kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 20kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 2500kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 250kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 500kDa | | |
| Hyaluronate rhodamine - Molecular Weight - 50kDa | | |
| Low Molecular Weight Polyamide Resin ALFA01 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA02 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA03 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA04 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA05 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA06 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA07 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA08 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA09 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA10 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA11 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA12 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA13 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA14 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA15 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA16 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA17 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low molecular weight protamine | Low molecular weight protamine is a cell-penetrating peptide with vascular endothelial growth factor ( VEGF ) inhibitory activity. Low molecular weight protamine can inhibit tumor growth and is used in cancer research [1]. Uses: Scientific research. Group: Peptides. Alternative Names: LMWP. CAS No. 121052-30-0. Pack Sizes: 5 mg; 10 mg. Product ID: HY-P5107. |  |
| O, O'-Bis(2-aminopropyl) polypropylene glycol-block-Polyethylene glycol-block-polypropylene glycol (Molecular Weight ~ 1900) | O, O'-Bis(2-aminopropyl) polypropylene glycol-block-Polyethylene glycol-block-polypropylene glycol (Molecular Weight ~ 1900). Group: Polypropylene (pp). CAS No. 65605-36-9. Mole weight: CH3CH (NH2)CH2[OCH (CH3)CH2]l (OCH2CH2)m[OCH2CH (CH3)]nNH2. | |
| Peptidylprolyl Isomerase F (PPIF) Recombinant, Mouse, Unstained Protein Molecular Weight Marker | Peptidylprolyl Isomerase F (PPIF) Recombinant, Mouse, Unstained Protein Molecular Weight Marker. Group: Molecular Biology. Grades: Highly Purified. Pack Sizes: 15ul. US Biological Life Sciences. | Worldwide |
| Polypropylene carbonate diol, molecular weight | Polypropylene carbonate diol, molecular weight. Group: Polypropylene (pp). | |
| Polystyrene (narrow molecular weight distribution) (Mn:14.36×104g/mol; Mw:17.24×104g/mol; intrinsic viscosity:67.79mL/g) | Polystyrene (narrow molecular weight distribution) (Mn:14.36×104g/mol; Mw:17.24×104g/mol; intrinsic viscosity:67.79mL/g). Group: Polystyrene (ps). CAS No. 9003-53-6. Product ID: styrene. Mole weight: (C8H8)n. C=CC1=CC=CC=C1. InChI=1S / C8H8 / c1-2-8-6-4-3-5-7-8 / h2-7H, 1H2. PPBRXRYQALVLMV-UHFFFAOYSA-N. | |
| Polystyrene (narrow molecular weight distribution) (Mn:4.18×104g/mol; Mw:4.63×104g/mol; intrinsic viscosity:27.10mL/g) | Polystyrene (narrow molecular weight distribution) (Mn:4.18×104g/mol; Mw:4.63×104g/mol; intrinsic viscosity:27.10mL/g). Group: Polystyrene (ps). CAS No. 9003-53-6. Product ID: styrene. Mole weight: (C8H8)n. C=CC1=CC=CC=C1. InChI=1S / C8H8 / c1-2-8-6-4-3-5-7-8 / h2-7H, 1H2. PPBRXRYQALVLMV-UHFFFAOYSA-N. | |
| Polystyrene (narrow molecular weight distribution) (Mn:50.4×104g/mol; Mw:63.5×104g/mol; intrinsic viscosity:169.13mL/g) | Polystyrene (narrow molecular weight distribution) (Mn:50.4×104g/mol; Mw:63.5×104g/mol; intrinsic viscosity:169.13mL/g). Group: Polystyrene (ps). CAS No. 9003-53-6. Product ID: styrene. Mole weight: (C8H8)n. C=CC1=CC=CC=C1. InChI=1S / C8H8 / c1-2-8-6-4-3-5-7-8 / h2-7H, 1H2. PPBRXRYQALVLMV-UHFFFAOYSA-N. | |
| Polystyrene (narrow molecular weight distribution) (Mw:4050g/mol;Mn:3800g/mol) | Polystyrene (narrow molecular weight distribution) (Mw:4050g/mol;Mn:3800g/mol). Group: Polystyrene (ps). CAS No. 9003-53-6. Product ID: styrene. Mole weight: (C8H8)n. C=CC1=CC=CC=C1. InChI=1S / C8H8 / c1-2-8-6-4-3-5-7-8 / h2-7H, 1H2. PPBRXRYQALVLMV-UHFFFAOYSA-N. | |
| Polystyrene (narrow molecular weight distribution) (Mw:4680g/mol;Mn:4550g/mol) | Polystyrene (narrow molecular weight distribution) (Mw:4680g/mol;Mn:4550g/mol). Group: Polystyrene (ps). CAS No. 9003-53-6. Product ID: styrene. Mole weight: (C8H8)n. C=CC1=CC=CC=C1. InChI=1S / C8H8 / c1-2-8-6-4-3-5-7-8 / h2-7H, 1H2. PPBRXRYQALVLMV-UHFFFAOYSA-N. | |
| Polystyrene standards, Low molecular weight | analytical standard, pkg of 1 kit. Uses: Low molecular weight polystyrene can be used as an adhesive additive to asphalt. polystyrene standards has been used in the calibration of the molecular weights of aqueous polymer samples obtained from microcalorimetric measurements whose peak molecular weight can be determined using gel permeation chromatography(gpc). polystyrene standards, low molecular weight is used as a calibration standard for the gel permeation chromatographic (gpc) determination of molecular weight measurements of lignin extracted from poplar and pine, in the production of lignin-derived activated carbon (ac) materials. Group: Polystyrene (ps). Pack Sizes: pkg of 1 kit. | |
| Poly(vinyl chloride), high molecular weight | Poly(vinyl chloride), high molecular weight. Uses: Battery manufacturing. Group: Polyvinyl chloride (pvc). Alternative Names: PVC. CAS No. 9002-86-2. Mole weight: (CH2CHCl)n. ClC=C. InChI=1S/C2H3Cl/c1-2-3/h2H,1H2. BZHJMEDXRYGGRV-UHFFFAOYSA-N. | |
| Poly(vinyl chloride), low molecular weight | Poly(vinyl chloride), low molecular weight. Group: Polyvinyl chloride (pvc). Alternative Names: PVC. CAS No. 9002-86-2. Molecular formula: ~48000. Mole weight: (CH2CHCl)n. ClC=C. InChI=1S/C2H3Cl/c1-2-3/h2H,1H2. BZHJMEDXRYGGRV-UHFFFAOYSA-N. | |
| Ultra High Molecular Weight Polyethylene(UHMW-PE) | UHMW-PE is a fine material with spherical particles for use in coatings, lubricants, and polyolefin and polyamide compounding. This material contributes to improved dispersion when mixed with other fillers, and adds improved lubrication, scratch and impact resistance to the final polymeric compound. Uses: Fiber, medical, building & construction, automotive. Group: other plastics. | |
| 04:1 Coenzyme A Sodium salt | 04:1 Coenzyme A Sodium salt is a fundamental biochemical compound prevalent in the biomedical sector, demonstrating its indispensability as a coenzyme involved in diverse metabolic pathways. Its remarkable functionality aids in the seamless transfer of acyl groups. Moreover, owing to its profound impact on lipid metabolism, this product emerges as a potential solution in the treatment of metabolic afflictions, including obesity, diabetes, and cardiovascular anomalies. Synonyms: (E)-but-2-enoyl Coenzyme A (sodium salt); sodium (2R, 3S, 4R, 5R) -5- (6-amino-9H-purin-9-yl) -2- ( ( ( ( ( ( (R) -4- ( (3- ( (2- ( ( (E) -but-2-enoyl) thio) ethyl) amino) -3-oxopropyl) amino) -3-hydroxy-2, 2-dimethyl-4-oxobutoxy) oxidophosphoryl) oxy) oxidophosphoryl) oxy) methyl) -4-hydroxytetrahydrofuran-3-yl hydrogen phosphate; 9H-Purin-6-amine, 9- [ (2ξ ) -5-O- [hydroxy [ [hydroxy [ (3R) -3-hydroxy-2, 2-dimethyl-4-oxo-4- [ [3-oxo-3- [ [2- [ [ (2E) -1-oxo-2-buten-1-yl] thio] ethyl] amino] propyl] amino] butoxy] phosphinyl] oxy] phosphinyl] -3-O-phosphono-β -D-threo-pentofuranosyl] -, sodium salt (1:3). Grades: >99%. CAS No. 2260670-60-6. Molecular formula: C25H37N7Na3O17P3S. Mole weight: 901.55. | |
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