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Chitosan oligomer (Dp 3-7) - Molecular weight 1000 is a chitosan oligomer with a remarkable molecular weight of 1000. From studying inflammation to expediting wound recovery, this masterpiece emerges as the epitome of groundbreaking drug delivery systems. Molecular formula: (C6H11NO4)n.
Cripto, FRL1, Cryptic Family 1 (CFC1) Recombinant, Human, Unstained Protein Molecular Weight Marker
Cripto, FRL1, Cryptic Family 1 (CFC1) Recombinant, Human, Unstained Protein Molecular Weight Marker. Group: Molecular Biology. Grades: Highly Purified. Pack Sizes: 15ul. US Biological Life Sciences.
Worldwide
Deoxyribonucleic acid low molecular weight from salmon sperm
Cas No. 100403-24-5.
Enoxaparin Sodium Molecular Weight Calibrant A
United States Pharmacopeia (USP) Reference Standard. Group: Pharmacopeia & metrological institutes standards.
Enoxaparin Sodium Molecular Weight Calibrant B
United States Pharmacopeia (USP) Reference Standard. Group: Pharmacopeia & metrological institutes standards.
Heparin Sodium Molecular Weight Calibrant
United States Pharmacopeia (USP) Reference Standard. Group: Pharmacopeia & metrological institutes standards.
High Molecular Weight Filgrastim
United States Pharmacopeia (USP) Reference Standard. Group: Pharmacopeia & metrological institutes standards.
High molecular weight insulin human
United States Pharmacopeia (USP) Reference Standard. Group: Pharmacopeia & metrological institutes standards.
High Molecular Weight Polyamide Resin
This polyamide resin is a high molecular weight resin designed to provide laminating inks with a combination of excellent adhesion and viscosity stability. Uses: Laminating ink with superior bonding ability. Group: Alcohol soluble polyamide resins.
Human Kininogen (Single Chain High Molecular Weight)
High Molecular Weight Kininogen (HK) is a non-enzymatic cofactor of the contact activation system. HK is thought to have two functions in the contact activation system. First, HK links Prekallikrein to a negatively charged surface thereby allowing activation of Kallikrein by surface bound Factor a-XIIa. HK also forms a complex with Factor XI and accelerates its activation to XIa by a-XIIa. Additionally HK serves as a source of Bradykinin, a potent vasoactive peptide important in hypotension studies. The protein purity is determined by SDS-PAGE. Group: Zymogens. Purity: >95% by SDS-PAGE. Kininogen. Mole weight: 120000. Storage: 2-8°C. Source: Human. Human Kininogen (Single Chain High Molecular Weight); Kininogen. Pack: 1mg. Cat No: CZY-028.
Human Kininogen (Two Chain High Molecular Weight)
ERL offers the two chain Kinin-free form of Kininogen. This is prepared by Kallikrein digestion of Kininogen which is then repurified to remove traces of Kallikrein. Group: Zymogens. Purity: >95% by SDS-PAGE. Kininogen. Mole weight: 110000. Storage: 2-8°C. Source: Human. Human Kininogen (Two Chain High Molecular Weight); Kininogen. Pack: 1mg. Cat No: CZY-029.
United States Pharmacopeia (USP) Reference Standard. Group: Pharmacopeia & metrological institutes standards.
Low Molecular Weight Polyamide Resin ALFA01
This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA02
This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA03
This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA04
This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA05
This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA06
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA07
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA08
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA09
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA10
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA11
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA12
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA13
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA14
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA15
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA16
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low Molecular Weight Polyamide Resin ALFA17
The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins.
Low molecular weight protamine
Low molecular weight protamine is a cell-penetrating peptide with vascular endothelial growth factor ( VEGF ) inhibitory activity. Low molecular weight protamine can inhibit tumor growth and is used in cancer research [1]. Uses: Scientific research. Group: Peptides. Alternative Names: LMWP. CAS No. 121052-30-0. Pack Sizes: 5 mg; 10 mg. Product ID: HY-P5107.
O, O'-Bis(2-aminopropyl) polypropylene glycol-block-Polyethylene glycol-block-polypropylene glycol (Molecular Weight ~ 1900)