Find where to buy products from suppliers in the USA, including: distributors, industrial manufacturers in America, bulk supplies and wholesalers of raw ingredients & finished goods.
Search for products or services, then visit the American suppliers website for prices, SDS or more information. You can also view suppliers in Australia, NZ or the UK.
| Product | Description | |
|---|---|---|
| 1H,1H,2H,2H-Perfluorodecyltrimethoxysilane | A raw material in area of anti-reflective coating, soil-repellent coating and moisture & oil- repellent coatings. Group: Silicon catalysts. Alternative Names: Trimethoxy(1H,1H,2H,2H-Heptadecafluorodecyl)Silane; (Heptadecafluoro-1,1,2,2-Tetradecyl)Trimethoxysilane. CAS No. 83048-65-1. Molecular formula: C13H13F17O3Si. Mole weight: 568.3. Appearance: Colorless liquid. Purity: ≥97%. IUPACName: 3, 3, 4, 4, 5, 5, 6, 6, 7, 7, 8, 8, 9, 9, 10, 10, 10-heptadecafluorodecyl (trimethoxy)silane. Canonical SMILES: CO[Si] (CCC (C (C (C (C (C (C (C (F) (F)F) (F)F) (F)F) (F)F) (F)F) (F)F) (F)F) (F)F) (OC)OC. Density: 1.453 g/mL. ECNumber: N/A. Catalog: ACM83048651. |  |
| 2-Butanone oxime,C4H9NO,96-29-7 | Mainly used inalkyd paintanti-skinningagentand siliconcuring agent.The product is used to prevent the use of the crust. It is better than butyraldehydeoxime, cyclohexanone oxime in effect. Used in organic synthesis For a variety of oil-based paint, alkyd paint, epoxy paint, such as esters during storage and transportation of anti-skinning process, also used as a curing agent silicon. Group: Platinum catalysts. Alternative Names: methylethyl ketoxime; CTK0G7034; N-butan-2-ylidenehydroxylamine; 103055-EP2301918A1; butan-2-one oxime; ZINC242701543; 96-29-7; 2-Butanone, oxime; 2-Butanoneoxime; 2-Butanone, oxime, (E)-. CAS No. 96-29-7. Molecular formula: C4H9NO. Mole weight: 87.122g/mol. IUPACName: N-butan-2-ylidenehydroxylamine. Canonical SMILES: CCC(=NO)C. Density: 0.9232 at 68 ° F (NTP, 1992);0.9232 g/cu cm at 20 deg C. ECNumber: 202-496-6. Catalog: ACM96297. | |
| Dichloro (N, N, N', N'-tetramethylethylenediamine) palladium (II) | Catalyst for: Cross-coupling reactions. Catalytic reduction reactions. Preparation of silyl ethers via reaction of silicon-hydrogen bond with alcohols. Oxidative carbonylation reactions. Group: Palladium series catalysts. Alternative Names: I14-10025; AC1L4Z7Y; AC1Q1RTB; Palladium, dichloro(N,N,N',N'-tetramethyl-1,2-ethanediamine-N,N')-, (SP-4-2)- (9CI); RL01764; Palladium, dichloro(N, N, N', N'-tetramethylethylenediamine)- (8CI); AKOS015900158; TRA0000186; dichloride. CAS No. 14267-08-4. Molecular formula: C6H16Cl2N2Pd. Mole weight: 293.528g/mol. IUPACName: palladium(2+);N, N, N', N'-tetramethylethane-1, 2-diamine;dichloride. Canonical SMILES: CN(C)CCN(C)C.[Cl-].[Cl-].[Pd+2]. Catalog: ACM14267084. | |
| Ethyltriacetoxysilane | Triacetoxysilyl ethyl does not contain any additives such as catalysts, stabilizers or adhesion promoters. Usually used as a curing agent. Group: Silicone. Alternative Names: Ethyltriacetoxysilane; [diacetyloxy(ethyl)silyl] acetate; Triacetoxy(Ethyl)Silane; (Triacetoxy)ethylsilane. CAS No. 17689-77-9. Pack Sizes: 10 g; 100 g. Product ID: [diacetyloxy(ethyl)silyl]acetate. Molecular formula: 243.28 g/mol. Mole weight: C8H14O6Si. CC[Si](OC(=O)C)(OC(=O)C)OC(=O)C. KXJLGCBCRCSXQF-UHFFFAOYSA-N. 0.95. |  |
| Graphene oxide, ammonia functionalized | N-doped graphene may be prepared by chemical vapor deposition (CVD), direct synthesis of N-graphene and also by electrical annealing of graphene nanoribbons in NH3 in the presence of NH3.Another technique of preparing N-doped graphene by microbial reduction of graphene oxide was reported. N doping alters the electrical properties of graphene effectively by modifying its band structure. A report also shows that doped graphene can act as excellent support for Pt catalysts and show better performance in Li ion batteries. Uses: Dielectric materials for field effect transistors (fet); non-silicon-based materials for integrated circuits (ic). nitrogen doping (n-doping) can improve electro-conductivity of graphene sheet. Group: 3d printing materials carbon nano materials. | |
| Platinum Cyclovinylmethylsiloxane Complexe, platinum concentration in cyclic vinylmethylsiloxanes | Platinum Cyclovinylmethylsiloxane Complexe, platinum concentration in cyclic vinylmethylsiloxanes. Uses: Neutral Lower reactivity, for high temperature (>100°C) extruded silicone formulations. Group: Platinum Catalysts. CAS No. 68585-32-0. Product ID: PC085. |  |
| Platinum Divinyl Complex, platinum concentration in xylene, Optically clear - 2% Pt | Platinum Divinyl Complex, platinum concentration in xylene, Optically clear. Uses: Highest reactivity, for applications where cured silicones require High transparency. Group: Platinum Catalysts. CAS No. 68478-92-2. Product ID: PC074. | |
| Platinum Octanol / Octanal Complexe, platinum concentration in Octanol | Platinum Octanol / Octanal Complexe, platinum concentration in Octanol. Uses: Low reactivity, for high temperature (>100°C) extruded silicone formulations. Useful as fire retardant in silicone resins. Group: Platinum Catalysts. CAS No. 68585-32-0. Product ID: PC088.3. | |
| Aluminum silicate N-hydrate | Heterocyclic Organic Compound. Alternative Names: Aluminumoxidesilicate; aluminumoxidesilicate(al2o(sio4)); SILLIMANITE; SILICA-ALUMINA CATALYST SUPPORT;PYRAX ABB;PYROPHYLLITE;MONTMORILLONITE (ALUMINUM PILLARED CLAY);FIBERFRAX(R). CAS No. 12141-46-7. Molecular formula: Al2O5Si. Mole weight: 162.0456. Purity: Purity >98%. IUPACName: dialuminum;oxygen(2-);silicon(4+). Density: g/cm³. Catalog: ACM12141467. | |
| Aluminum-Silicon Alloy Powder(1-2 μm) | Aluminum-Silicon Alloy Powder(1-2 μm). Uses: Repair work, lightweight material production, catalyst support. Group: Alloys nanopowders. | |
| Aluminum-Silicon Alloy Powder(4-5 μm) | Aluminum-Silicon Alloy Powder(4-5 μm). Uses: Repair work, lightweight material production, catalyst support. Group: Alloys nanopowders. | |
| Dimethyldimethoxysilane | Dimethyldimethoxysilane is used mainly to render a wide range of surfaces and materials water repellent (e.g.mineral fillers,pigment,glass cardboard). Dimethyldimethoxysilane may be used pure or in solution to treat fillers, using suitable mixing equipment.It may be necessary to first pre-treat the substrate with water and/or a catalyst. Dimethyldimethoxysilane is also used in the production of silicone resins and condensation-curing silicone rubber. Uses: It can be used as a resin modifier or a resin additive for various silicone resins.it can be used as a structure control agent and a chain extender for silicone rubbers, to replace hydroxyl silicone oil and improve the mechanical properties and extend the shelf life of the rubbers. Group: Micro/nanoelectronics. Alternative Names: Dimethyldimethoxysilane. CAS No. 1112-39-6. Molecular formula: C4H12O2Si. Mole weight: 120.22 g/mol. Appearance: Colorless transparent liquid. Purity: 0.98. Density: 0.8663±0.0050 g/mL. Catalog: ACM1112396. | |
| Divinyltetramethyldisiloxane | Tetramethyldivinyl disiloxane is an organic compound with the chemical formula C8H18OSi2 and the appearance of a colorless transparent liquid. Uses: It is used as a linear inhibitor in the formulating of two-part silicone rtv-2 addition curing systems. because of the large vinyl content, small amounts are very effective in retarding and controlling the working time or pot life of two-part addition-curing silicone rtvs. also, due to its boiling point of 139c, it is easily volatilized during curing. a suggested starting formulation is to use 0.25 to 0.50 parts by weight of usi-o6214 with 100 parts of the base polymer containing the platinum catalyst. Group: Siloxanes. Alternative Names: 3, 3, 5, 5-tetramethyl-3, 5-disila-4-oxa-1, 6-heptadiene; Divinyltetramethyldi; 1, 3-DIVINyltetraMETHYLDISILOXANE; Tetramethyldivinylsiloxane; Tetramethyl-1, 3-divinyldisiloxane. CAS No. 2627-95-4. Molecular formula: C8H18OSi2. Mole weight: 186.4 g/mol. Appearance: Colorless liquid. Purity: 95%+. IUPACName: ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane. Canonical SMILES: C[Si](C)(C=C)O[Si](C)(C)C=C. Density: 0.813. ECNumber: 220-099-6. Catalog: ACM2627954. | |
| Graphene Oxide (GO) TEM Support Films | Graphene Oxide (GO) support film is available as Single Layer (0.6~1nm) or Double Layer (1~1.5nm) measured by EELS. It is hydrophilic and naturally placed over the ultra-flat Silicon Dioxide Substrate, Lacey Carbon (300 Mesh Copper TEM Grids) or Holy Silicon Nitride Membranes with typically 50-70% coverage. Available in package of 5, 10 or 25 pieces. A. 300 Mesh Copper TEM grid with Lacey Carbon film; B. 00nm-thick 2μm Diameter Holey Silicon Nitride Membrane on 200μm-thick Silicon Substrate; C. 5x5mm 675μm-thick Silicon Die with 200nm Thermal Oxide. Uses: 1) catalyst2) supercapacitors3) solar energy4) graphene semiconductor chips5) conductive graphene film6) graphene computer memory7) biomaterials8) transparent conductive coatings. Group: Graphenes. | |
| Graphene Oxide (GO) TEM Support Films | Graphene Oxide (GO) support film is available as Single Layer (0.6~1nm) or Double Layer (1~1.5nm) measured by EELS. It is hydrophilic and naturally placed over the ultra-flat Silicon Dioxide Substrate, Lacey Carbon (300 Mesh Copper TEM Grids) or Holy Silicon Nitride Membranes with typically 50-70% coverage. Available in package of 5, 10 or 25 pieces. A. 300 Mesh Copper TEM grid with Lacey Carbon film; B. 00nm-thick 2μm Diameter Holey Silicon Nitride Membrane on 200μm-thick Silicon Substrate; C. 5x5mm 675μm-thick Silicon Die with 200nm Thermal Oxide. Uses: 1) catalyst2) supercapacitors3) solar energy4) graphene semiconductor chips5) conductive graphene film6) graphene computer memory7) biomaterials8) transparent conductive coatings. Group: other nano materials. | |
| Holmium(III) fluoride | Dysprosium is most commonly used as in Neodymium-iron-boron high strength permanent magnets. While it has one of the highest magnetic moments of any of the rare earths (10.6uB), this has not resulted in an ability to perform on its own as a practical alternative to Neodymium compositions. It is however now an essential additive in NdFeB production. It is also used in special ceramic compositions based on BaTiO formulations. Dysprosium is used, in conjunction with Vanadium and other elements, in making laser materials and commercial lighting. Nanofibers of Dysprosium compounds have high strength and large surface area. Therefore, they can be used to reinforce other materials and as a catalyst. Recent research has examined the use of Dysprosium in Dysprosium-iron-garnet (DyFeG) and silicon implanted with Dysprosium and Holmium to form donor centers. Dysprosium Metal is an important additive for NdFeB permanent magnets to raise the Curie temperature and improve temperature coefficiency. Another most promising use of high purity Dysprosium Metal is in the magnetostrictive alloy TEFENOL-D. There are also other applications for some special master alloys. It is highly susceptible to magnetization, they are employed in various data-storage applications, such as in hard disks. Group: Metal & ceramic materials. Alternative Names: HoF3;Holmium fluoride (HoF3); holmiumfluoride(hof3); HOLMIUM(III) FLUORIDE;HOLMIUM FLUORIDE;holm | |
| TETRAMETHYLAMMONIUM HYDROXIDE, SOLUTION1.0 Mol/L in WATER, REAGENT (ACS) | Industry Application Role/benefit Organic silicon Production of dimethyl silicone oil, organic silicon resin, silicon rubber, etc. Catalyst/removed easily; no pollution to the products Chemical analysis Polarography experiment Polarographic reagent Thermochemolysis to study fungal degradation of wood Analytical reagent Chemical purification Removal of metal elements Ash free alkali/source of base; make the metal elements precipitated Electron Production of computer silicon chip Brightening agent; anisotropic etching agent; cleaning agent; photoresist developer Printing of circuit board Cleaning agent Semiconductor manufacturing Chemical stripper Others Synthesis of ferrofluid Surfactant/ inhibit nanoparticle aggregation Synthesis of zeolite Structure directing agent. Group: Ammonium ionic liquids. Alternative Names: Tetramethylammonium hydroxide solution, ~25% in H2O; tetra methyl ammonium hydroxide; 75-59-2; Tetrametiloamonio hydroxido; Tetramethylammonium hydroxide solution, 25 wt. % in methanol; Tetrametanoamonio hydroxido; A838458; DB-050413; tetramethylammoniumhydroxide; AC1Q29QX. CAS No. 75-59-2. Molecular formula: C4H13NO. Mole weight: 91.154g/mol. IUPACName: tetramethylazanium;hydroxide. Canonical SMILES: C[N+](C)(C)C.[OH-]. Density: Specific gravity of solution approximately 1.00 at 24 deg C/4 deg C. ECNumber: 200-882-9. Catalog: ACM75592. | |
Our database is helping our users find suppliers everyday.
