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| Product | Description | |
|---|---|---|
| Copper molybdate | Copper molybdate. Uses: Designed for use in research and industrial production. Additional or Alternative Names: CUPRIC MOLYBDATE;COPPER(II) MOLYBDATE;COPPER MOLYBDATE;COPPER MOLYBDENUM OXIDE;copper molybdenum tetraoxide;Molybdic acid copper(II) salt. Product Category: Metal & Ceramic Materials. Appearance: Powder. CAS No. 13767-34-5. Molecular formula: CuMoO4. Mole weight: 223.48. Purity: 0.96. IUPACName: copper dioxido(dioxo)molybdenum. Density: 3.4. Product ID: ACM13767345. Alfa Chemistry ISO 9001:2015 Certified. |  |
| Copper Nanodispersion | Copper Nanodispersion. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. 99.9%. |  |
| Copper Nano Dispersion | Copper Nano Dispersion. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.55g/mol. Mole weight: Cu. 99.9%. | |
| Copper Nanofoil | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55g/mol. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. 99.9%, 99.99%, 99.999%. | |
| Copper Nanoparticle | Copper Nanoparticle. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. Mole weight: Cu. 99.9%. | |
| Copper Nanoparticles | Copper Nanoparticles. Group: Elements nanoparticlesmetal nano dispersion. 99.9%+. | |
| Copper Nanoparticles Dispersion | Copper Nanoparticles Dispersion. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.55g/mol. Mole weight: Cu. 99.9 %. | |
| Copper Nanoparticles Ink | Copper Nanoparticles Ink. Group: Oxide nano dispersionmetal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.55g/mol. Mole weight: Cu. 99.9 %. | |
| Copper nanopowder | Copper nanopowder. Group: Nanofibers. 99.9% (metal basis). | |
| Copper nano Powder | Copper nano Powder. Group: Metal nano dispersion. 0.998. | |
| Copper Nanopowder | Copper Nanopowder. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. Mole weight: Cu. 99.9%. | |
| Copper Nanorods | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanorods. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanorods | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanorods Properties | Copper Nanorods Properties. Group: Nanorods. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. (99%, 99.9%, 99.99%). | |
| Copper Nanotubes | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanotubes. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanotubes | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanotubes Properties | Copper Nanotubes Properties. Group: Nanotubes. CAS No. 7440-50-8. Molecular formula: 63.55 g/mol. (99%, 99.9%, 99.99%). | |
| Copper Nanowire | Copper Nanowire. Group: Nanowires. ≥96.5. | |
| Copper Nanowire Dispersion | Copper Nanowire Dispersion. Group: Nanowires. Product ID: copper. Molecular formula: 63.55. [Cu]. | |
| Copper nanowire dispersion (20nm) | Copper nanowire dispersion (20nm). Group: Nanowires. | |
| Copper nanowire dispersion (40nm) | Copper nanowire dispersion (40nm). Group: Nanowires. | |
| Copper nanowires | Copper nanowires. Group: Nanowires. ≥ 96.5 %. | |
| Copper nanowires | Copper nanowires. Group: Nanoparticles. ≥ 96.5 %. | |
| Copper Nanowires | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. > 99.99%. | |
| Copper Nanowires | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanowires. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. > 99.99%. | |
| Copper nanowires 100nm*10um | Copper nanowires 100nm*10um. Group: Nanowires. | |
| Copper Nanowires, 40-50 nm | Copper Nanowires, 40-50 nm. Group: other s. | |
| Copper Nanowires Properties | Copper Nanowires Properties. Group: Nanowires. CAS No. 7440-50-8. Molecular formula: 63.55 g/mol. (99%, 99.9%, 99.99%). | |
| Copper Nickel Alloy nanoparticles | Copper Nickel Alloy nanoparticles. Group: Compounds nanoparticles. | |
| Copper Nickel Alloy Nanopowder | Copper Nickel Alloy Nanopowder. Group: Alloys nanopowders. Mole weight: Cu/Ni. 99.9%. | |
| Copper Nickel Cu-Ni Alloy Powder | Copper Nickel Cu-Ni Alloy Powder. Uses: Manufacture multi-layer ceramic capacitor terminals and internal electrodes, electronic components, electronic paste, etc. Group: Alloy powders. >99.5%. | |
| Copper Nickel (Cu-Ni) Alloy Sputtering Targets | Copper Nickel (Cu-Ni) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Nickel (Cu-Ni) Alloy Sputtering Targets, Cu-Ni Alloy Sputtering Target, Cu-Ni Alloy Sputter Target, Cu-Ni Alloy Target, Copper Nickel Alloy Sputtering Target, Copper Nickel Alloy Sputter Target, Copper Nickel Alloy Target. CAS No. 12064-62-9. 99.95%. | |
| Copper Nickel Foil | Copper Nickel Foil. Group: Metal foils. CAS No. 471-34-1. ≥99.9%. | |
| Copper Nickel Sulfide | Copper Nickel Sulfide. Group: Battery materials. | |
| Copper Nickel wire, 0.075mm (0.003in) dia | Copper Nickel wire, 0.075mm (0.003in) dia. Group: Alloys. | |
| Copper Nickel wire, 0.13mm (0.005in) dia | Copper Nickel wire, 0.13mm (0.005in) dia. Group: Alloys. | |
| Copper Nickel wire, 0.25mm (0.01in) dia | Copper Nickel wire, 0.25mm (0.01in) dia. Group: Alloys. | |
| Copper Nickel wire, 0.5mm (0.02in) dia | Copper Nickel wire, 0.5mm (0.02in) dia. Group: Alloys. | |
| Copper Nickel wire, 1.6mm (0.064in) dia | Copper Nickel wire, 1.6mm (0.064in) dia. Group: Alloys. | |
| Copper Nitride | COPPER NITRIDE, 99.5% pure, -200 mesh, Formula: Cu3N. CAS No. 1308-80-1. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! |  Texas TX |
| Copper No.1 Etchant | Copper & Brass (nitric acid and DI water). Group: Etchants. | |
| Copper No.2 Etchant | Copper & Brass (HCl and ferric chloride). Group: Etchants. | |
| Copper (O) | certified Reference Material, rod. Group: Certified reference materials (crms). |  |
| Copper Oxide Aluminium Core Shell | Copper Oxide Aluminium Core Shell. Group: Core shell nanoparticles. 99.9%. | |
| Copper Oxide (CuO) | Copper Oxide (CuO). Group: Magnetic nanoparticles. Alternative Names: High Purity Copper Oxide (CuO); 99.99% Copper Oxide (CuO); 99.999% Copper Oxide (CuO); ; high purity copper oxide; high purity copper(II) oxide; high purity cupric oxide. 3N-4N. | |
| Copper Oxide (CuO) Nano Powder | Copper Oxide (CuO) Nano Powder. Group: Oxides nanoparticles. 99.9%. | |
| Copper Oxide (CuO) Sputtering Targets | Copper Oxide (CuO) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Oxide (CuO) Sputtering Targets, CuO Sputtering Target, CuO Sputter Target, CuO Target, Copper Oxide Sputtering Target, Copper Oxide Sputter Target, Copper Oxide Target. 99.7%. | |
| Copper Oxide Dispersion | Copper Oxide Dispersion. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9 %. | |
| Copper Oxide Ink | Copper Oxide Ink. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9%. | |
| Copper oxide nano-chains | Copper oxide nano-chains. Group: Nanoparticles. CAS No. 1317-38-0. | |
| Copper oxide nanoparticles | Copper oxide nanoparticles. Group: Oxides nanoparticleselements nanoparticlescompounds nanoparticles. >99.9%. | |
| Copper Oxide Nanoparticles | Copper Oxide Nanoparticles. Group: Oxides nanoparticles. CAS No. 1317-38-0. Molecular formula: 79.54 g/mol. Mole weight: CuO. 99.9 %. | |
| Copper Oxide Nanoparticles (CuO) | Copper Oxide Nanoparticles (CuO). Group: Elements nanoparticles. 99+ %. | |
| Copper Oxide Nanoparticles Dispersion | Copper Oxide Nanoparticles Dispersion. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9%. | |
| Copper Oxide Nanoparticles / Nanopowder | Copper Oxide Nanoparticles / Nanopowder. Group: Nanopowders. Alternative Names: Copper(II) oxide nanopowder. CAS No. 1317-38-0. Product ID: Copperoxygen(2-). Molecular formula: 79.55. Mole weight: CuO. [Cu]=O. InChI=1S/Cu.O. QPLDLSVMHZLSFG-UHFFFAOYSA-N. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Oxide Nanopowder | Copper Oxide Nanopowder. Group: Oxides nanoparticles. CAS No. 1317-38-0. Molecular formula: 79.54 g/mol. Mole weight: CuO. 99.9 %. | |
| Copper Oxide NanoPowder | Copper Oxide NanoPowder. Group: Nanofibers. >99.95+%. | |
| Copper Oxide Nanorods | Copper Oxide Nanorods. Group: Nanorods. 99.5+%. | |
| Copper Oxide Powder | Copper Oxide Powder. Group: Oxides nanoparticles. CAS No. 1317-38-0. Molecular formula: 79.55g/mol. 99.5%. | |
| Copper Oxychloride | Copper Oxychloride. Group: other nano materials. CAS No. 1332-65-6. Molecular formula: 213.57. Mole weight: Cu2Cl.(OH)3. | |
| Copper Palladium Silicon (Cu-Pd-Si) Alloy Sputtering Targets | Copper Palladium Silicon (Cu-Pd-Si) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Palladium Silicon (Cu-Pd-Si) Alloy Sputtering Targets, Alloy (Pd77.5Cu6Si16.5 at%) Sputtering Target, Cu-Pd-Si Alloy Sputtering Target, Cu-Pd-Si Alloy Sputter Target, Cu-Pd-Si Alloy Target, Copper Palladium Silicon Alloy Sputtering Target. 99.95%. | |
| Copper pellets 1/4x1/2 | Copper, pellets, 1/4x1/2. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-4. |  www.prochemonline.com |
| Copper pellets 1/4x1/2 | Copper, pellets, 1/4x1/2. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm , 1 kg. Order Number: 1524. | www.prochemonline.com |
| Copper pellets 1/4x1/4 | Copper, pellets, 1/4x1/4. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-5. | www.prochemonline.com |
| Copper pellets 1/4x1/4 | Copper, pellets, 1/4x1/4. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-1. | www.prochemonline.com |
| Copper pellets 1/8x1/4 | Copper, pellets, 1/8x1/4. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-2. | www.prochemonline.com |
| Copper pellets 1/8x1/4 | Copper, pellets, 1/8x1/4. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm , 1 kg. Order Number: 1524-6. | www.prochemonline.com |
| Copper pellets 1/8x1/8 | Copper, pellets, 1/8x1/8. Grades: 99.99% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm , 1 kg. Order Number: 1524-3. | www.prochemonline.com |
| Copper pellets 1/8x1/8 | Copper, pellets, 1/8x1/8. Grades: 99.998% Extremely High (>=99%). CAS No. 7440-50-8. Pack Sizes: Gram Quantities: 200 gm, 1 kg. Order Number: 1524-7. | www.prochemonline.com |
| Copper Peptide Powder > 98% | Copper Peptide Powder > 98%. |  CA, FL & NJ |
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