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| Product | Description | |
|---|---|---|
| C5 Aliphatic Hydrocarbon Resin Used in Adhesives Purified 99.9%min | C5 Aliphatic Hydrocarbon Resin Used in Adhesives Purified 99.9%min. Group: Aliphatic resins. |  |
| C5 hydrocarbon resin for hot melt adhesive LAB GRADE 99.9% | C5 hydrocarbon resin for hot melt adhesive LAB GRADE 99.9%. Group: Chemical resins. | |
| C5 Petroleum Resin for Hot Melt Adhesives | C5 Petroleum Resin for Hot Melt Adhesives. Group: Aliphatic resins. | |
| 2,6-Dimethyl-4-heptanone | Diisobutyl ketone is used as a solvent fornitrocellulose, lacquers, and synthetic resins;in organic syntheses.;Uses Diisobutyl ketone (DIBK) is a transparent liquid with a distinct odor and a high boiling point. It is an heavy-end byproduct of producing MIBK. DIBK is used in many applications such as nitrocellulose lacquers, synthetic resins, coatings and stains, paint strippers, leather finishings, adhesives, printing and coating inks, cleaning and dregreasing, Flavors and fragrances, solvent and re-crystallization aid for pharmaceuticals, mining, and as a chemical intermediate. DIBK has good activity for many synthetic resins including nitrocellulose, rosin esters, phenolics, hydrocarbons, alkyds, polyesters, and acrylics. It is useful as a retarder solvent to improve flow and minimize humidity blushing. The low density and low surface tension of DIBK enables formulators to develop high-solids coatings with low VOC content and excellent flow and leveling properties. DIBK has excellent viscosity reduction for and reduces surface tension in high solids coatings. It has good volume-to-weight advantage over other classes of solvents used in coatings. Alternative Names: isovaleron; METHYL NONYL KETONE, 2-HENDECANONE; 2,6-dimethylheptan-4-one; DIISOBUTYL KETONE (DIBK): CP; 2,6-Dimethylheptan-4-one; DIISOBUTYL KETONE FOR SYNTHESIS; DIISOBUTYLKETONE; ISOBUTYL KETONE; FEMA 3537; DIBK; Diisobutyl Ketone; 2,6-Dimethyl-4-H |  |
| 3,4-Epoxycyclohexylmethyl 3,4-Epoxycyclohexanecarboxylate | 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (EEC) is a cycloaliphatic epoxy that can be synthesized by the reaction of 3'-cyclohexenylmethyl 3-cyclohexenecarboxylate with peracetic acid. Its aliphatic backbone and molecular structure provide a number of useful properties such as thermal stability, weatherability, and electrical conductivity. Uses: Eec is an epoxy monomer that can be used as a resin in aerospace, electronics and automobile industries as an adhesive and a composite material. Group: Monomers. Alternative Names: 7-Oxabicyclo[4.1.0]Heptan-3-Ylmethyl 7-Oxabicyclo[4.1.0]Heptane-3-Carboxylate. CAS No. 2386-87-0. Pack Sizes: Packaging 50, 250 mL in poly bottle. Product ID: 7-oxabicyclo[4.1.0]heptan-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate. Molecular formula: 252.31. Mole weight: C14H20O4. C1CC2C(O2)CC1COC(=O)C3CCC4C(C3)O4. InChI=1S/C14H20O4/c15-14 (9-2-4-11-13 (6-9)18-11)16-7-8-1-3-10-12 (5-8)17-10/h8-13H, 1-7H2. YXALYBMHAYZKAP-UHFFFAOYSA-N. 95%+. | |
| 3,4-Epoxycyclohexylmethyl 3,4-Epoxycyclohexanecarboxylate | 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (EEC) is a cycloaliphatic epoxy that can be synthesized by the reaction of 3'-cyclohexenylmethyl 3-cyclohexenecarboxylate with peracetic acid. Its aliphatic backbone and molecular structure provide a number of useful properties such as thermal stability, weatherability, and electrical conductivity. Uses: Eec is an epoxy monomer that can be used as a resin in aerospace, electronics and automobile industries as an adhesive and a composite material. Group: Polymer/macromolecule. Alternative Names: 7-Oxabicyclo[4.1.0]Heptan-3-Ylmethyl 7-Oxabicyclo[4.1.0]Heptane-3-Carboxylate. CAS No. 2386-87-0. Molecular formula: C14H20O4. Mole weight: 252.31. Purity: 95%+. IUPACName: 7-oxabicyclo[4.1.0]heptan-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate. Canonical SMILES: C1CC2C(O2)CC1COC(=O)C3CCC4C(C3)O4. Density: 1.17 g/ml. ECNumber: 219-207-4;609-326-3. Catalog: ACM2386870-2. | |
| 3-Glycidoxypropyltrimethoxysilane | It is epoxy functional silane used as adhesion promoters in SPUR, urethane, epoxy, polysulfide, silicone, and acrylic caulks, coatings, sealants and adhesives. Uses: It can improve the dry and wet strength of cured composites reinforced by glass fiber rovings, enhance the wet electrical properties of epoxy resin-based encapsulation and packaging materials, without the need to use separate primers in polysulfide and polyurethane sealants, and improve water-based acrylic adhesion of sealant, polyurethane and epoxy coatings. Group: Polymers. Alternative Names: Tetraethyl Orthosilicate ?Ethyl Silicate); Etylukrzemian(Polish); Silane, Tetraethoxy-; Silane,Tetraethoxy-; Silbond Condensed; Silester; Silicate D'Ethyle; Silicate Tetraethylique. CAS No. 2530-83-8. Pack Sizes: Packed with 5 L, 20 L or 210 L plastic/steel drum, 1000 L IBC container, or according to customer's requirement. Product ID: 3-Glycidoxypropyltrimethoxysilane. Molecular formula: 236.34. Mole weight: C9H20O5Si. 98%. | |
| 3-Glycidoxypropyltrimethoxysilane | It is epoxy functional silane used as adhesion promoters in SPUR, urethane, epoxy, polysulfide, silicone, and acrylic caulks, coatings, sealants and adhesives. Uses: It can improve the dry and wet strength of cured composites reinforced by glass fiber rovings, enhance the wet electrical properties of epoxy resin-based encapsulation and packaging materials, without the need to use separate primers in polysulfide and polyurethane sealants, and improve water-based acrylic adhesion of sealant, polyurethane and epoxy coatings. Group: Siloxanes. Alternative Names: Tetraethyl Orthosilicate ?Ethyl Silicate); Etylukrzemian(Polish); Silane, Tetraethoxy-;Silane, Tetraethoxy-;Silbond Condensed;Silester;Silicate D'Ethyle;Silicate Tetraethylique. CAS No. 2530-83-8. Molecular formula: C9H20O5Si. Mole weight: 236.34. Appearance: Colorless clear liquid. Purity: 0.98. IUPACName: 3-Glycidoxypropyltrimethoxysilane. Density: 1.07 g/mL. ECNumber: 219-784-2. Catalog: ACM2530838. | |
| 3-(Trimethoxysilyl)-1-Propanamine | It is an important additive in many applications, examples include: Glass fiber or glass fabric composites:As a size ingredient or finish Glass and metal primers,Foundry resins: As an additive to cold curing phenolic and furan resins,Sealants and adhesives: As a primer or additive and for chemical modification,Mineral-filled polymers (composites): For pretreatment of fillers and pigments Paints and coatings: As an additive and primer for improving adhesion to the substrate. Group: Biomaterials. Alternative Names: 3-Aminopropyltrimethoxysilane;(3-Aminopropyl)trimethoxysilane;(3-Aminopropyl) trimethoxysilane; 3-(Trimethoxysilyl)propan-1-amine; 3-trimethoxysilylpropan-1-amine. CAS No. 13822-56-5. Molecular formula: C6H17NO3Si. Mole weight: 179.29 g/mol. Appearance: Colorless transparent liquid. Purity: 0.97. Density: 1.01. ECNumber: 237-511-5. Catalog: ACM13822565. | |
| 4,4'-bis-(2,3-Epoxypropoxy)biphenyl | 4,4'-bis-(2,3-Epoxypropoxy)biphenyl is a chemical compound commonly used in the production of epoxy resins for electronic components and structural adhesives. It has also been studied for its potential as an anti-cancer drug due to its ability to inhibit the growth of certain types of cancer cells. Synonyms: Oxirane, 2,2'-[[1,1'-biphenyl]-4,4'-diylbis(oxymethylene)]bis-; 4,4'-Bis(oxiran-2-ylmethoxy)-1,1'-biphenyl. Grades: 98%. CAS No. 2461-46-3. Molecular formula: C18H18O4. Mole weight: 298.336. |  |
| α-Cetone | Isonaline 70 is an industrial solvent that belongs to the family of high flash point aromatic naphtha solvents. It is commonly used in a variety of industries including paints and coatings, adhesives and rubber manufacturing, as a thinner and thinner for resins and polymers. Isonaline 70 has various properties that make it suitable for these applications, including its low viscosity, high solvency and good compatibility with other materials. In addition, it can also be used as a cleaning agent for mechanical equipment. Uses: Scientific research. Group: Biochemical assay reagents. Alternative Names: Isomethyl-α-ionone; α-Isomethylionone. CAS No. 127-51-5. Pack Sizes: 5 g; 10 g. Product ID: HY-W127740. |  |
| Benzene Soluble Type Co Solvent Polyamide Resin ALFA01 | This resin product is a clear solid co-solvent polyamide resin in pale yellow granular form. Standard grade. Uses: Co-solvent soluble polyamide resin to produce gravure plastic printing ink, paper gravure printing ink and hot melt adhesive. Group: Benzene soluble polyamide resins. 0.99. | |
| Benzene Soluble Type Co Solvent Polyamide Resin ALFA02 | This resin product is a clear solid co-solvent polyamide resin in pale yellow granular form. Standard grade. Uses: Co-solvent soluble polyamide resin to produce gravure plastic printing ink, paper gravure printing ink and hot melt adhesive. Group: Benzene soluble polyamide resins. 0.99. | |
| Benzene Soluble Type Co Solvent Polyamide Resin ALFA03 | This resin product is a clear solid co-solvent polyamide resin in pale yellow granular form that improves ink strength. Uses: Co-solvent soluble polyamide resin to produce gravure plastic printing ink, paper gravure printing ink and hot melt adhesive. Group: Benzene soluble polyamide resins. 0.99. | |
| Benzene Soluble Type Co Solvent Polyamide Resin ALFA04 | This resin product is a pale yellow granular transparent solid co-solvent polyamide resin with excellent adhesion to untreated PE/PP. Uses: Co-solvent soluble polyamide resin to produce gravure plastic printing ink, paper gravure printing ink and hot melt adhesive. Group: Benzene soluble polyamide resins. 0.99. | |
| Bisphenol A propoxylate diglycidyl ether | Bisphenol A propoxylate diglycidyl ether (BPDG) is an epoxy based resin that can be cured by ring opening mechanism of the oxirane groups in the monomer. It can be used to form structurally consistent and thermally stable composites for a variety of applications. Uses: Bpdg can be used as a reinforcing material for silica aerogel for enhancing the thermo-mechanical properties of the composite. it can also be used to form hydrophilic epoxy networks which can potentially be used for surface coating and structural adhesives. Group: Polymer/macromolecule. Alternative Names: Bisphenol A bis(propylene glycol glycidyl ether )ether. CAS No. 106100-55-4. Molecular formula: C27H36O6. Mole weight: 456.571140 [g/mol]. Purity: 0.96. IUPACName: 2-[3-[4-[2-[4-[3-(oxiran-2-ylmethoxy)propoxy]phenyl]propan-2-yl]phenoxy]propoxymethyl]oxirane. Canonical SMILES: CC (C) (c1ccc (OCCCOCC2CO2)cc1)c3ccc (OCCCOCC4CO4)cc3. Catalog: ACM106100554-1. | |
| Butyl acrylate resin | Butyl acrylate appears as a clear colorless liquid with a sharp characteristic odor. Very slightly soluble in water and somewhat less dense than water. Hence forms surface slick on water. Flash point 105°F. Density 7.5 lb / gal. Used for making paints, coatings, caulks, sealants, adhesives.;Liquid;COLOURLESS LIQUID WITH CHARACTERISTIC ODOUR.;Clear, colorless liquid with a strong, fruity odor.;Clear, colorless liquid with a strong, fruity odor. [Note: Highly reactive; may contain an inhibitor to prevent spontaneous polymerization.]. Group: Biomaterials. Alternative Names: butyl acrylate resin;POLY(N-BUTYL ACRYLATE);POLY(BUTYL ACRYLATE);N-BUTYL ACRYLATE RESIN; 2-Propenoicacid, butylester, homopolymer; Acrylicacid, butylester, homopolymer; n-butylacrylateresin(40%intoluene; ButylacrylateresinintoluenemedMWt. CAS No. 9003-49-0. Molecular formula: CH2=CHCOOC4H9;C7H12O2;C7H12O2. Mole weight: 128.17g/mol. IUPACName: butyl prop-2-enoate. Canonical SMILES: CCCCOC(=O)C=C. Density: 0.899 at 68 °F (USCG, 1999);0.8898 g/cu cm at 20 °C;Relative density (water = 1): 0.90;0.89;0.89. ECNumber: 205-480-7;618-366-0. Catalog: ACM9003490. | |
| Butyl acrylate resin | Butyl acrylate appears as a clear colorless liquid with a sharp characteristic odor. Very slightly soluble in water and somewhat less dense than water. Hence forms surface slick on water. Flash point 105°F. Density 7.5 lb / gal. Used for making paints, coatings, caulks, sealants, adhesives.;Liquid;COLOURLESS LIQUID WITH CHARACTERISTIC ODOUR.;Clear, colorless liquid with a strong, fruity odor.;Clear, colorless liquid with a strong, fruity odor. [Note: Highly reactive; may contain an inhibitor to prevent spontaneous polymerization.]. Group: Polymers. Alternative Names: butyl acrylate resin; POLY(N-BUTYL ACRYLATE); POLY(BUTYL ACRYLATE); N-BUTYL ACRYLATE RESIN; 2-Propenoicacid,butylester,homopolymer; Acrylicacid,butylester,homopolymer; n-butylacrylateresin(40%intoluene; ButylacrylateresinintoluenemedMWt. CAS No. 9003-49-0. Product ID: butyl prop-2-enoate. Molecular formula: 128.17g/mol. Mole weight: CH2=CHCOOC4H9;C7H12O2;C7H12O2. CCCCOC(=O)C=C. InChI=1S/C7H12O2/c1-3-5-6-9-7 (8)4-2/h4H, 2-3, 5-6H2, 1H3. CQEYYJKEWSMYFG-UHFFFAOYSA-N. | |
| Butyl Methacrylate | N-butyl methacrylate appears as a clear colorless liquid. Flash point 130°F. Less dense (7.5 lb / gal) than water and insoluble in water. Hence floats on water. Vapors heavier than air. Used to make resins adhesives, and oil additives.;Liquid;COLOURLESS LIQUID WITH CHARACTERISTIC ODOUR. Group: Polymers. CAS No. 97-88-1. Pack Sizes: 1 kg. Product ID: butyl 2-methylprop-2-enoate. Molecular formula: 142.2g/mol. Mole weight: C8H14O2. CCCCOC(=O)C(=C)C. InChI=1S/C8H14O2/c1-4-5-6-10-8 (9)7 (2)3/h2, 4-6H2, 1, 3H3. SOGAXMICEFXMKE-UHFFFAOYSA-N. | |
| Butyl Methacrylate | N-butyl methacrylate appears as a clear colorless liquid. Flash point 130°F. Less dense (7.5 lb / gal) than water and insoluble in water. Hence floats on water. Vapors heavier than air. Used to make resins adhesives, and oil additives.;Liquid;COLOURLESS LIQUID WITH CHARACTERISTIC ODOUR. Group: Polymers. Product ID: butyl 2-methylprop-2-enoate. Molecular formula: 142.2g/mol. Mole weight: C8H14O2; CH2C(CH3)COO(CH2)3CH3; C8H14O2. CCCCOC(=O)C(=C)C. InChI=1S/C8H14O2/c1-4-5-6-10-8 (9)7 (2)3/h2, 4-6H2, 1, 3H3. SOGAXMICEFXMKE-UHFFFAOYSA-N. | |
| Butyl Methacrylate (stabilized with HQ) | N-butyl methacrylate appears as a clear colorless liquid. Flash point 130°F. Less dense (7.5 lb / gal) than water and insoluble in water. Hence floats on water. Vapors heavier than air. Used to make resins adhesives, and oil additives.;Liquid;COLOURLESS LIQUID WITH CHARACTERISTIC ODOUR. Group: Monomers. CAS No. 97-88-1. Product ID: butyl 2-methylprop-2-enoate. Molecular formula: 142.2g/mol. Mole weight: C8H14O2; CH2C(CH3)COO(CH2)3CH3; C8H14O2. CCCCOC(=O)C(=C)C. InChI=1S/C8H14O2/c1-4-5-6-10-8 (9)7 (2)3/h2, 4-6H2, 1, 3H3. SOGAXMICEFXMKE-UHFFFAOYSA-N. | |
| Butyl Methacrylate, (stabilized with HQ) | N-butyl methacrylate appears as a clear colorless liquid. Flash point 130°F. Less dense (7.5 lb / gal) than water and insoluble in water. Hence floats on water. Vapors heavier than air. Used to make resins adhesives, and oil additives.;Liquid;COLOURLESS LIQUID WITH CHARACTERISTIC ODOUR. Group: Polymers. CAS No. 97-88-1. Product ID: butyl 2-methylprop-2-enoate. Molecular formula: 142.2g/mol. Mole weight: C8H14O2; CH2C(CH3)COO(CH2)3CH3; C8H14O2. CCCCOC(=O)C(=C)C. InChI=1S/C8H14O2/c1-4-5-6-10-8 (9)7 (2)3/h2, 4-6H2, 1, 3H3. SOGAXMICEFXMKE-UHFFFAOYSA-N. | |
| Dicyandiamide | DryPowder; Liquid; OtherSolid; PelletsLargeCrystals;WHITE CRYSTALLINE POWDER. Uses: Dicyandiamide is used in the production of special resins, flame retardants, guanidine salts, etc., used as fillers in artificial leather, and used as a curing agent on adhesives. the printing and dyeing industry use dicyandiamide to manufacture fixing agents. the leather industry use it to make leather retanning agents. water treatment industry use it to make decolorant or flocculant. it can be used in electroplating and manufacturing steel surface hardener. it can also be used as fertilizer nitrification inhibitor in agriculture. electronic grade dicyandiamide is mainly used for epoxy resin curing agents in the manufacture of copper clad laminates for the electronic information industry, inner coating films for food and beverage metal packaging, high-grade non-toxic flame retardants, additives for food plastics, special pharmaceutical intermediates. Group: Nitrogen flame retardant. CAS No. 461-58-5. Molecular formula: C2H4N4. Mole weight: 84.08. Appearance: White crystal. Purity: 99.5%, electronic grade 99.7%. IUPACName: 2-cyanoguanidine. Canonical SMILES: NC(=N)NC#N. Density: 1.400 @ 25 °C/4 °C;1.4 g/cm³. Catalog: ACM461585. | |
| Dicyandiamide | DryPowder; Liquid; OtherSolid; PelletsLargeCrystals;WHITE CRYSTALLINE POWDER. Uses: Dicyandiamide is used in the production of special resins, flame retardants, guanidine salts, etc., used as fillers in artificial leather, and used as a curing agent on adhesives. the printing and dyeing industry use dicyandiamide to manufacture fixing agents. the leather industry use it to make leather retanning agents. water treatment industry use it to make decolorant or flocculant. it can be used in electroplating and manufacturing steel surface hardener. it can also be used as fertilizer nitrification inhibitor in agriculture. electronic grade dicyandiamide is mainly used for epoxy resin curing agents in the manufacture of copper clad laminates for the electronic information industry, inner coating films for food and beverage metal packaging, high-grade non-toxic flame retardants, additives for food plastics, special pharmaceutical intermediates. Group: Polymerization reagents. CAS No. 461-58-5. Product ID: 2-cyanoguanidine. Molecular formula: 84.08. Mole weight: C2H4N4. NC(=N)NC#N. 1S/C2H4N4/c3-1-6-2(4)5/h(H4,4,5,6). QGBSISYHAICWAH-UHFFFAOYSA-N. 99.5%, electronic grade 99.7%. | |
| Dimethoxymethylphenylsilane | Liquid. Uses: It as monomer of synthetic phenyl polymer, can function as bellows: be used as other silanes and siloxanes intermediates be used for hydrophobic surface treatment be used as hydrophobic additive to other silane coupling agents be used in the manufacture phenyl silicone oil, silicone resin, silicone adhesive, etc. Group: Silane coupling agentsself assembly and contact printing materials. Alternative Names: Methyl-phenyl-dimethoxysilane. CAS No. 3027-21-2. Pack Sizes: In 25 L pail, 200 L drum and 1000 L. Product ID: dimethoxy-methyl-phenylsilane. Molecular formula: 182.29. Mole weight: C9H14O2Si. CO[Si](C)(C1=CC=CC=C1)OC. InChI=1S/C9H14O2Si/c1-10-12(3, 11-2)9-7-5-4-6-8-9/h4-8H, 1-3H3. CVQVSVBUMVSJES-UHFFFAOYSA-N. >98%. | |
| Ebecryl 3708 resin | Ebecryl 3708 resin is a modified bisphenol A epoxy bisacrylate with low viscosity and excellent curing reaction. Ebecryl 3708 resin films cured by ultraviolet light (UV) or electron beam (EB) show good flexibility, high gloss, toughness and excellent impact resistance. It can be used in clear coatings for paper, wood, flexible and rigid plastics, topcoats for wood and metal trim vehicles, adhesives for paper or film laminating, and lithography and screen ink vehicles. | |
| Low Molecular Weight Polyamide Resin ALFA01 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA02 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA03 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA04 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA05 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA06 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA07 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA08 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA09 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA10 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA11 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA12 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA13 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA14 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA15 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA16 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA17 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Methyl hydrogenated rosinate | Use as Film-forming agent. Use as adhesive. Use as plasticizer. Group: Non-ionic surfactants. Alternative Names: Resin acids and rosin acids, hydrogenated, methyl esters;Rosin, hydrogenated, methyl ester. CAS No. 8050-15-5. Catalog: ACM8050155. | |
| Methyl rosinate | Use as Film-forming agent. Use as adhesive. Use as plasticizer. Group: Non-ionic surfactants. Alternative Names: Resin acids and rosin acids, methyl esters. CAS No. 68186-14-1. Catalog: ACM68186141. | |
| Para Tertiary Butylphenol Formaldehyde Resin | Para Tertiary Butylphenol Formaldehyde Resin is a phenol-formaldehyde resin found in commercial adhesives, and in particular in adhesives used to bond leather and rubber. Synonyms: p-tert-butylphenol-formaldehyde resin; PTBP-FR; PTBPFR; 4-(1,1-dimethylethyl) phenol; PTBP Formaldehyde. | |
| Poly(4-Vinylphenol) | The polymer product is a hydrophobic material that is insoluble in water or other polar solvents. Uses: Substitute for novolac resins in photoresists, adhesion promoter and improves heat resistance in hot melt adhesives and surface treatment in metal finishing. derivatives used as antioxidants and flame retardants in plastics. component of polymer blends to modify surface characteristics and improve impact resistance. Group: Bioelectronic materials hydrophobic polymersorganic field effect transistor (ofet) materials. Alternative Names: PVP, Poly(4-hydroxystyrene). CAS No. 24979-70-2. Pack Sizes: 5, 25 g in poly bottle. Molecular formula: Mw ~11,000. Mole weight: (C8H8O)n. Oc1ccc(C=C)cc1. 1S/C8H10O/c1-2-7-3-5-8(9)6-4-7/h3-6, 9H, 2H2, 1H3. HXDOZKJGKXYMEW-UHFFFAOYSA-N. 98%. | |
| Poly(acetaldehyde-resorcinol) | Poly(acetaldehyde-resorcinol). Group: Polymers. Alternative Names: acetaldehyde-resorcinol copolymer; Acetaldehyde-resorcinol resin; poly(acetaldehyde-resorcinol); Acetaldehyde, polymer with 1,3-benzenediol; Acetaldehyde resorcinol reaction product; Rubber adhesive RE. CAS No. 28410-56-2. Product ID: acetaldehyde; benzene-1,3-diol. Molecular formula: 154.16g/mol. Mole weight: C8H10O3. CC=O.C1=CC(=CC(=C1)O)O. InChI=1S/C6H6O2. C2H4O/c7-5-2-1-3-6(8)4-5; 1-2-3/h1-4, 7-8H; 2H, 1H3. GQOYDWTWEHXGDV-UHFFFAOYSA-N. | |
| Poly(butyl methacrylate) | Additional Benefit:Conventional high molecular weight poly(butyl methacrylate) easily forms a fused block that require mechanical force (such as hammering) to break it down into small particles before usage. This product was developed with an anti-blocking technology and comes in an easy-to-use, free flowing, bead form. Uses: Poly(butyl methacrylate) finds applications in various areas.it may be used to study the photoluminescence in eutfc embedded in poly(butyl methacrylate) (pbma) polymer films.it has also been used for coatings, surface modification, solid state battery, silk screen inks, adhesives for plastic and aluminum, plasticizer for hard butyl methacrylate resins, and for improving outdoor durability of vinyl chloride resins in pigmented lacquers. Group: Bioelectronic materials hydrophobic polymersself assembly and lithography. Alternative Names: PBMA. CAS No. 9003-63-8. Pack Sizes: 5, 250 g in poly bottle. Product ID: butyl 2-methylprop-2-enoate. Molecular formula: 142.2g/mol. Mole weight: (C8H14O2)n. CCCCOC(=O)C(C)=C. 1S/C8H14O2/c1-4-5-6-10-8(9)7(2)3/h2, 4-6H2, 1, 3H3. SOGAXMICEFXMKE-UHFFFAOYSA-N. | |
| Poly(Butyl Methacrylate) | N-butyl methacrylate appears as a clear colorless liquid. Flash point 130°F. Less dense (7.5 lb / gal) than water and insoluble in water. Hence floats on water. Vapors heavier than air. Used to make resins adhesives, and oil additives.;Liquid;COLOURLESS LIQUID WITH CHARACTERISTIC ODOUR. Group: Polymers. Product ID: butyl 2-methylprop-2-enoate. Molecular formula: 142.2g/mol. Mole weight: C8H14O2; CH2C(CH3)COO(CH2)3CH3; C8H14O2. CCCCOC(=O)C(=C)C. InChI=1S/C8H14O2/c1-4-5-6-10-8 (9)7 (2)3/h2, 4-6H2, 1, 3H3. SOGAXMICEFXMKE-UHFFFAOYSA-N. | |
| Polyethylene Terephthalate, (polyester, PET, PETP), fabric, weight.m-2-92g, thickness 0.13 mm | PET is a general-purpose thermoplastic polymer that belongs to the polyester family of polymers. Known for their excellent combination of properties such as mechanical, thermal, chemical resistance as well as dimensional stability, polyester resins are suitable for extruded applications that require clarity, toughness and consistent processing performance. PET can be alloyed and compounded with engineering resins. Polyester resins are low cost, withstand temperatures up to 80?C, offer good wetting to glass fibers, have a relatively low shrinkage of 4% ? 8% during curing, and provide a linear expansion ranging from 100 - 200 x 10-6 K-1. Uses: Food and beverage bottles and containers | flexible food packaging | thermal insulation | clothing | biaxially oriented pet film | tape (magnetic, pressure-sensitive adhesive) | 3d printing filament | 3d printing plastic petg | alloy with engineering resins | disposable packaging trays | blister packs | thin film solar cells | waterproof barrier in undersea cables. Group: Polyethylene terephthalate (pet). | |
| Polyisobutylene | Polyisobutylene. CAS No. 9003-27-4. Product ID: PE-0477. Mole weight: 100000-10000000. Category: Binder Excipients. Product Keywords: Pharmaceutical Excipients; Excipients for Solid Dosage Form; Polyisobutylene; Binder Excipients; Binder Excipients; 9003-27-4; 9003-27-4. UNII: NA. Chemical Name: Polyisobutylene. Grade: Pharmceutical Excipients. Administration route: Topical; Transdermal. Dosage Form: Film, system. Applications: Polyisobutylene is mixed with paraffin and resin to improve the quality of chewing gum, and at the same time make the chewing gum softer and more stable, maintain good hydrophobicity, and have excellent film properties. It can also be mixed with various cross-adhesives (including pressure-sensitive adhesives) to make food-grade adhesives, mixed with various paraffin waxes and high-molecular polymers, used as a release agent for packaging films, and can also be used to make food packaging or Food grade hot melt adhesive. |  |
| Poly(methyl methacrylate) | Methyl methacrylate monomer appears as a clear colorless liquid. Slightly soluble in water and floats on water. Vapors heavier than air. Vapors irritate the eyes and respiratory system. Containers must be heavily insulated or shipped under refrigeration. An inhibitor such as hydroquinone, hydroquinone methyl ester and dimethyl t-butylphenol is added to keep the chemical from initiating polymerization. The chemical may polymerize exothermically if heated or contaminated with strong acid or base. If the polymerization takes place inside a container, the container may rupture violently. Used to make plastics. Uses: Acrylates and methacrylates are monomers that are combined with other monomers or polymers to produce plastics used in cosmetics, medicine, dentistry, and manufacturing industries.occupational asthma in operating room nurse; used to make lucite, plexiglas, paper coatings, latex paints, inks, polishes, dental restorations, adhesive cements, surgical implants, and impregnated concrete. Synonyms: METHYL METHACRYLATE POLYMER; METHYL METHACRYLATE, POLYMERIZED; METHYL METHACRYLATE RESIN; METHACRYLIC ACID METHYL ESTER POLYMER; LUCITE; POLY(METHYL METHACRYLATE-CO-ETHYL ACRYLATE); POLY(METHYL METHACRYLATE), ISOTACTIC; POLY(METHYL METHACRYLATE). Grades: 98%. CAS No. 9011-14-7. Molecular formula: (C5H8O2)x. Mole weight: 99.1083. | |
| Poly(p-toluenesulfonamide-co-formaldehyde) | Poly(p-toluenesulfonamide-co-formaldehyde). CAS No. 25035-71-6. Pack Sizes: 25 kg. Product ID: CDC10-0293. Molecular formula: C8H11NO3S. Category: Cosmetic Plasticizers. Product Keywords: Cosmetic Ingredients; Cosmetic Plasticizers; Poly(p-toluenesulfonamide-co-formaldehyde); CDC10-0293; 25035-71-6; C8H11NO3S; 25035-71-6. Purity: 0.99. Melting Point: 82 °C. Product Description: Toluenesulfonamide formaldehyde resin is used as intensifier and plasticizer in polyamide, epoxy resin, phenol-formaldehyde resin, printing inks, coatings etc.;Uses Toluene sulfonamide formaldehyde resin is used as modifier and adhesion promotor for film-forming natural and synthetic resins; in vinyllacquers, nitrocellulose compositions (naillacquers), polyvinyl alcohol adhesives, acrylics. | |
| Poly(styrene-co-α-methylstyrene) | The polymer product is a hydrophobic material that is insoluble in water or other polar solvents. Uses: Additive to sealants, caulks, adhesives, and coatings. Group: Polystyrene (ps). Alternative Names: Styrene-α-methylstyrene resin, α-Methylstyrene-styrene, α-Methylstyrene-styrene polymer, Styrene-α-methylstyrene copolymer. CAS No. 9011-11-4. Pack Sizes: 250 g in poly bottle. Product ID: prop-1-en-2-ylbenzene; styrene. Molecular formula: 222.32g/mol. Mole weight: [CH2CH(C6H5)]x[CH2C(CH3)(C6H5)]y. CC(=C)C1=CC=CC=C1.C=CC1=CC=CC=C1. InChI=1S/C9H10. C8H8/c1-8(2)9-6-4-3-5-7-9; 1-2-8-6-4-3-5-7-8/h3-7H, 1H2, 2H3; 2-7H, 1H2. ZAKVZVDDGSFVRG-UHFFFAOYSA-N. | |
| Poly(vinyl formal) | The polymer product is a hydrophobic material that is insoluble in water or other polar solvents. Uses: Our hydrophobic polymers are used as coatings, adhesives, fibers, films and engineering plastics. furthermore, they are widely used as biomedical polymers for vascular grafts, implants and ophthalmic applications. Group: Biomaterials. Alternative Names: POLY(VINYL FORMAL);VINYL FORMAL POLYMER;VINYLEC K; 1, 1'-[methylenebis(oxy)]bis-ethenhomopolymer; Ethene, 1, 1'-[methylenebis(oxy)]bis-, homopolymer; polyvinylformalstaplefiber; Vinylacetate, polymerwithformaldehyde; FORMVAR RESIN. CAS No. 9003-33-2. Molecular formula: C5H8O2. Mole weight: 100.12g/mol. Purity: Purity >98%. IUPACName: ethenoxymethoxyethene. Canonical SMILES: C=COCOC=C. Density: 1.23 g/mL at 25 °C (lit.). ECNumber: 601-085-2. Catalog: ACM9003332-1. | |
| Poly(vinyl formal) | The polymer product is a hydrophobic material that is insoluble in water or other polar solvents. Uses: Our hydrophobic polymers are used as coatings, adhesives, fibers, films and engineering plastics. furthermore, they are widely used as biomedical polymers for vascular grafts, implants and ophthalmic applications. Group: Hydrophobic polymerspolymers. Alternative Names: POLY(VINYL FORMAL); VINYL FORMAL POLYMER; VINYLEC K; 1,1'-[methylenebis(oxy)]bis-ethenhomopolymer; Ethene, 1, 1'-[methylenebis(oxy)]bis-, homopolymer; polyvinylformalstaplefiber; Vinylacetate, polymerwithformaldehyde; FORMVAR RESIN. CAS No. 9003-33-2. Product ID: ethenoxymethoxyethene. Molecular formula: 100.12g/mol. Mole weight: C5H8O2. C=COCOC=C. 1S/C5H8O2/c1-3-6-5-7-4-2/h3-4H, 1-2, 5H2. DFFZYNIDEOOVAU-UHFFFAOYSA-N. Purity >98%. | |
| Rosin Resins | Hydrogenated and non -hydrogenated gum rosin esters. Uses: Adhesives, Personal Care, Fragrances, Coatings. Group: Adhesive resins, Specialty Ingredients Suppliers, Fragrances, Perfumers. Alternative Names: FloraRez® Rosin Resins. Grades: Food Grade. Pack Sizes: Drums, Bags. Molecular formula: Specialty line of hydrogenated and non-hydrogenated gum rosin derivatives. |  |
| Triethylene glycol hydrogenated rosinate | Use as emulsifying agent, dispersing agent. Use as Film-forming agent. Use as adhesive. Group: Non-ionic surfactants. Alternative Names: PEG-3 Hydrogenated Rosinate;Resin acids and rosin acids, hydrogenated, esters with triethylene glycol. CAS No. 68648-53-3. Catalog: ACM68648533. | |
| Tung oil | Tung oil is an excellent vegetable oil with drying properties. It has the characteristics of fast drying, light specific gravity, good gloss, strong adhesion, heat resistance, Acid resistance, Alkali resistance, corrosion resistance, rust resistance, non-conductivity, etc. It is widely used. It is the main raw material for the manufacture of paints and inks. It is widely used as waterproof, anti-corrosion and anti-rust coatings for construction, machinery, weapons, vehicles and boats, fishing gear, and electrical appliances. insecticides, etc. Uses: Tung oil is a plant oil that can be polymerized to produce a variety of products which include pressure sensitive adhesives, self-healed epoxy coatings, polyurethane foam, and vinyl ester resins. Group: Polymer/macromolecule. Alternative Names: China wood oil. CAS No. 8001-20-5. Appearance: Liquid. Density: 0.937 g/mL at 25 °C (lit.). Catalog: ACM8001205. | |
| 1-[3-(Trimethoxysilyl)Propyl]Urea | 1-[3-(Trimethoxysilyl)Propyl]Urea. Uses: It is an essential silane coupling agent in the below industry: it is a diamine functional silane that find use as a coupling agent providing superior elongation, flexibility and spreading at the interface of polymers. it is used to promote adhesion between resins that react with amino groups and the surfaces of glass, mineral, metal, etc. its reduced alkoxy functionality is also useful in waterborne systems by providing lower reactivity and therefore higher stability in the aqueous environment. Group: Saltself-assembly materials silane coupling agentsself assembly and contact printing materials. Alternative Names: Gamma.-Ureidopropyltrimethoxysilane. CAS No. 23843-64-3. Pack Sizes: In 25 L pail, 200 L drum and 1000 L IBC. Product ID: 3-trimethoxysilylpropylurea. Molecular formula: 222.32. Mole weight: C7H18N2O4Si. CO[Si](CCCNC(=O)N)(OC)OC. LVACOMKKELLCHJ-UHFFFAOYSA-N. >94%. | |
| 1-[3-(Trimethoxysilyl)Propyl]Urea | It is an essential silane coupling agent in the below industry: It is a diamine functional silane that find use as a coupling agent providing superior elongation, flexibility and spreading at the interface of polymers. It is used to promote adhesion between resins that react with amino groups and the surfaces of glass, mineral, metal, etc. Its reduced alkoxy functionality is also useful in waterborne systems by providing lower reactivity and therefore higher stability in the aqueous environment. Group: Biomaterials. Alternative Names: Gamma.-Ureidopropyltrimethoxysilane. CAS No. 23843-64-3. Molecular formula: C7H18N2O4Si. Mole weight: 222.32. Appearance: Amber transparent liquid. Purity: >94%. IUPACName: 3-trimethoxysilylpropylurea. Canonical SMILES: CO[Si](CCCNC(=O)N)(OC)OC. Density: 1.066 g/mL. ECNumber: 2459048. Catalog: ACM23843643. | |
| 2-(3,4-Epoxycyclohexyl)Ethyltriethoxysilane | It can be mainly used for mineral-filled composite materials: used for the pretreatment of fillers and pigments or as additives for polymers; paints and coatings: used as additives and primers to improve adhesion to substrates; and polyurethane Compared with aminosilane, it has a longer shelf life; improved mechanical properties, such as flexural strength, tensile strength, impact strength and elastic modulus; improved moisture resistance and corrosion resistance; improved electrical properties, such as dielectric Constant, volume resistivity. Uses: As a finish or a size ingredient,an additive to polyurethane resins,a primer or additive,an additive to the polymer,an additive and as a primer for improving adhesion to the substrate,especially glass and metal. Group: Siloxanes. Alternative Names: 2-(3,4-Epoxycyclohexyl)Ethyltriethoxysilane. CAS No. 10217-34-2. Molecular formula: C14H28O4Si. Mole weight: 288.46. Appearance: Colorless transparent liquid. Purity: 0.98. IUPACName: triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane. Density: 1.003 g/mL. Catalog: ACM10217342. | |
| 3-(2-Aminoethylamino)Propyl-Dimethoxymethylsilane | It is a kind of super-soft finishing agent used for various organosilicon. It will help the modified silicon oil get greater fiber affinity and the features of soft, smooth, pendulous, anti-static, washable, anti-crease, etc. This product can be used as adhesion-promoting agent, surface modifying agent, crosslinking agent and dispersing agent for improving the binding force and compatibility between inorganic mineral powder material, fiber and polymer (resin). It can also improve the adhesion between resin coating and inorganic materials. Group: Siloxanes. Alternative Names: N-[3- (Dimethoxymethylsilyl) propyl]ethylenediamine. CAS No. 3069-29-2. Molecular formula: C8H22N2O2Si. Mole weight: 206.36. Appearance: Colorless transparent liquid. Purity: >95%. IUPACName: N'-[3-[dimethoxy (methyl)silyl]propyl]ethane-1, 2-diamine. Canonical SMILES: CO[Si](C)(CCCNCCN)OC. Density: 0.968 g/mL. ECNumber: 221-336-6. Catalog: ACM3069292. | |
| 3-Chloropropyltrimethoxysilane | It is Colorless transparent liquid, soluble in a variety of organic solvents,hydrolyze when meeting water. Uses: It can be used as a coupling agent to improve the adhesion between organic resins and inorganic surfaces, and as an intermediate for other functional organosilanes. Group: Siloxanes. Alternative Names: (3-Chloropropyl)Trimethoxy-Silan; A 143; Cc3300; Chloropropyltrimethoxysilane; Cps-M; Delta-Chloropropyltrimethoxysilane. CAS No. 2530-87-2. Molecular formula: C6H15ClO3Si. Mole weight: 198.72. Appearance: Colorless transparent liquid. Purity: 0.98. IUPACName: 3-chloropropyl(trimethoxy)silane. Canonical SMILES: CO[Si](CCCCl)(OC)OC. Density: 1.081 g/mL. ECNumber: 219-787-9. Catalog: ACM2530872. | |
| Alcohol Soluble Polyamide Resin ALFA27 | This alcohol-soluble polyamide resin is an economical and practical product. The resin has excellent solvent release and gloss, excellent pigment wetting, and good adhesion to most treated films and metal films. The resin also has high oxidation resistance. Anti-stickiness and frost resistance,which are widely used in printing inks. The product has good alcohol solubility and can be dissolved by using 95% anhydrous alcohol alone. It has excellent solvent release and is widely used in gravure and flexographic plastic film printing inks. Uses: Gravure ink; flexo ink. Group: Alcohol soluble polyamide resins. | |
| Benzene Soluble Polyamide Resin ALFA14 | It is a benzene-soluble polyamide resin with unique formula design, which has good ink anti-condensation ability and refreezing ability, excellent deflection ability and good adhesion to printing parts compared with other resins, and is suitable for formulating various gravure inks for printing on polyethylene, polypropylene, polyester and cellophane. Uses: It is suitable for the formulation of various gravure inks for printing on polyethylene, polypropylene, polyester and cellophane. Group: Benzene soluble polyamide resins. | |
| Chloromethyltriethoxysilane | It is a chlorine-containing compound, which always acts as an important intermediate for the preparation of functional silanes and silicone compounds. It's also known as triethoxychloromethylsilane. Uses: As freezing agent of silicon sulfide rubber in normal temperature, and as intermediate of silane coupling agent, etc. it can be used as a coupling agent to improve adhesion of organic resins to inorganic surfaces.it can be used as an intermediate for other functional organosilanes. Group: Siloxanes. Alternative Names: CHLOROMETHYLTRIETHOXYSILANE; (chloromethyl)triethoxy-silan; chlormethyl-triethoxysilan; triethoxy(chloromethyl)-silan; Silane, triethoxy(chloromethyl)-;Silane, (chloroMethyl)triethoxy-. CAS No. 15267-95-5. Molecular formula: C7H17ClO3Si. Mole weight: 212.75. Appearance: Colorless transparent liquid. Purity: 0.97. IUPACName: chloromethyl(triethoxy)silane. Canonical SMILES: CCO[Si](CCl)(OCC)OCC. Density: 1.048 g/mL. ECNumber: 239-311-3. Catalog: ACM15267955. | |
| Co Solvent Polyamide Resin ALFA01 | This product is a low freezing point benzene soluble polyamide resin with good cold resistance (i.e. good resistance to gelation) and indoor temperature frost transfer. The resin has good adhesion to most treated films and is significantly more compatible with NC than other homogeneous products. Uses: This product is is ideal for gravure printing inks. Group: Co solvent polyamide resins. | |
| Co Solvent Polyamide Resin ALFA03 | Co-solvent polyamide resins are soluble in alcohol mixtures or mixtures of alcohols and aliphatic hydrocarbon co-solvents. Uses: It is used in gravure inks and has excellent adhesion to untreated pe/pp. it also has excellent adhesion to treated pe/pp and aluminum foil. it has wide adaptability as an ink for both untreated and treated pe/pp. Group: Co solvent polyamide resins. | |
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