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| Product | Description | |
|---|---|---|
| 3,4-Epoxycyclohexylmethyl 3,4-Epoxycyclohexanecarboxylate | 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (EEC) is a cycloaliphatic epoxy that can be synthesized by the reaction of 3'-cyclohexenylmethyl 3-cyclohexenecarboxylate with peracetic acid. Its aliphatic backbone and molecular structure provide a number of useful properties such as thermal stability, weatherability, and electrical conductivity. Uses: Eec is an epoxy monomer that can be used as a resin in aerospace, electronics and automobile industries as an adhesive and a composite material. Group: Monomers. Alternative Names: 7-Oxabicyclo[4.1.0]Heptan-3-Ylmethyl 7-Oxabicyclo[4.1.0]Heptane-3-Carboxylate. CAS No. 2386-87-0. Pack Sizes: Packaging 50, 250 mL in poly bottle. Product ID: 7-oxabicyclo[4.1.0]heptan-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate. Molecular formula: 252.31. Mole weight: C14H20O4. C1CC2C(O2)CC1COC(=O)C3CCC4C(C3)O4. InChI=1S/C14H20O4/c15-14 (9-2-4-11-13 (6-9)18-11)16-7-8-1-3-10-12 (5-8)17-10/h8-13H, 1-7H2. YXALYBMHAYZKAP-UHFFFAOYSA-N. 95%+. |  |
| 3- (Glycidoxypropyl) methyldiethoxysilane | 3- (Glycidoxypropyl) methyldiethoxysilane, silane coupling agent KH-7180, is a versatile epoxy organo-reactive silane with two hydrolyzable ethoxy groups. It provides shelf stable non-yellowing adhesion promoter performance while enhancing physical properties in latexes and waterborne adhesive and sealant systems. Group: Biochemicals. Grades: Highly Purified. CAS No. 2897-60-1. Pack Sizes: 10g, 50g. Molecular Formula: C11H24O3Si, Molecular Weight: 232.39. US Biological Life Sciences. |  Worldwide |
| 3-Glycidoxypropyltrimethoxysilane | It is epoxy functional silane used as adhesion promoters in SPUR, urethane, epoxy, polysulfide, silicone, and acrylic caulks, coatings, sealants and adhesives. Uses: It can improve the dry and wet strength of cured composites reinforced by glass fiber rovings, enhance the wet electrical properties of epoxy resin-based encapsulation and packaging materials, without the need to use separate primers in polysulfide and polyurethane sealants, and improve water-based acrylic adhesion of sealant, polyurethane and epoxy coatings. Group: Polymers. Alternative Names: Tetraethyl Orthosilicate ?Ethyl Silicate); Etylukrzemian(Polish); Silane, Tetraethoxy-; Silane,Tetraethoxy-; Silbond Condensed; Silester; Silicate D'Ethyle; Silicate Tetraethylique. CAS No. 2530-83-8. Pack Sizes: Packed with 5 L, 20 L or 210 L plastic/steel drum, 1000 L IBC container, or according to customer's requirement. Product ID: 3-Glycidoxypropyltrimethoxysilane. Molecular formula: 236.34. Mole weight: C9H20O5Si. 98%. | |
| 4,4'-bis-(2,3-Epoxypropoxy)biphenyl | 4,4'-bis-(2,3-Epoxypropoxy)biphenyl is a chemical compound commonly used in the production of epoxy resins for electronic components and structural adhesives. It has also been studied for its potential as an anti-cancer drug due to its ability to inhibit the growth of certain types of cancer cells. Synonyms: Oxirane, 2,2'-[[1,1'-biphenyl]-4,4'-diylbis(oxymethylene)]bis-; 4,4'-Bis(oxiran-2-ylmethoxy)-1,1'-biphenyl. Grades: 98%. CAS No. 2461-46-3. Molecular formula: C18H18O4. Mole weight: 298.336. |  |
| Bisphenol A propoxylate diglycidyl ether | Bisphenol A propoxylate diglycidyl ether (BPDG) is an epoxy based resin that can be cured by ring opening mechanism of the oxirane groups in the monomer. It can be used to form structurally consistent and thermally stable composites for a variety of applications. Uses: Bpdg can be used as a reinforcing material for silica aerogel for enhancing the thermo-mechanical properties of the composite. it can also be used to form hydrophilic epoxy networks which can potentially be used for surface coating and structural adhesives. Additional or Alternative Names: Bisphenol A bis(propylene glycol glycidyl ether )ether. Product Category: Polymer/Macromolecule. CAS No. 106100-55-4. Molecular formula: C27H36O6. Mole weight: 456.571140 [g/mol]. Purity: 0.96. IUPACName: 2-[3-[4-[2-[4-[3-(oxiran-2-ylmethoxy)propoxy]phenyl]propan-2-yl]phenoxy]propoxymethyl]oxirane. Canonical SMILES: CC(C)(c1ccc(OCCCOCC2CO2)cc1)c3ccc(OCCCOCC4CO4)cc3. Product ID: ACM106100554-1. Alfa Chemistry ISO 9001:2015 Certified. |  |
| Dicyandiamide | DryPowder; Liquid; OtherSolid; PelletsLargeCrystals;WHITE CRYSTALLINE POWDER. Uses: Dicyandiamide is used in the production of special resins, flame retardants, guanidine salts, etc., used as fillers in artificial leather, and used as a curing agent on adhesives. the printing and dyeing industry use dicyandiamide to manufacture fixing agents. the leather industry use it to make leather retanning agents. water treatment industry use it to make decolorant or flocculant. it can be used in electroplating and manufacturing steel surface hardener. it can also be used as fertilizer nitrification inhibitor in agriculture. electronic grade dicyandiamide is mainly used for epoxy resin curing agents in the manufacture of copper clad laminates for the electronic information industry, inner coating films for food and beverage metal packaging, high-grade non-toxic flame retardants, additives for food plastics, special pharmaceutical intermediates. Group: Polymerization reagents. CAS No. 461-58-5. Product ID: 2-cyanoguanidine. Molecular formula: 84.08. Mole weight: C2H4N4. NC(=N)NC#N. 1S/C2H4N4/c3-1-6-2(4)5/h(H4,4,5,6). QGBSISYHAICWAH-UHFFFAOYSA-N. 99.5%, electronic grade 99.7%. | |
| Ebecryl 3708 resin | Ebecryl 3708 resin is a modified bisphenol A epoxy bisacrylate with low viscosity and excellent curing reaction. Ebecryl 3708 resin films cured by ultraviolet light (UV) or electron beam (EB) show good flexibility, high gloss, toughness and excellent impact resistance. It can be used in clear coatings for paper, wood, flexible and rigid plastics, topcoats for wood and metal trim vehicles, adhesives for paper or film laminating, and lithography and screen ink vehicles. | |
| Low Molecular Weight Polyamide Resin ALFA01 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA02 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA03 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA04 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA05 | This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc. as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting. as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA06 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA07 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA08 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA09 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA10 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA11 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA12 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA13 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA14 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA15 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA16 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Low Molecular Weight Polyamide Resin ALFA17 | The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. | |
| Poly(acrylonitrile-co-butadiene), dicarboxy terminated | The polymer product is a hydrophobic material that is insoluble in water or other polar solvents. Uses: Component of epoxy-based adhesives, composites and coatings. intermediate in corrosion-resistant vinyl esters, acrylated epoxies used in radiation curing and photopolymer printing plates. Group: other plastics. CAS No. 68891-46-3. Pack Sizes: 250 mL in poly bottle. Product ID: buta-1,3-diene; prop-2-enenitrile. Molecular formula: average Mn ~3,800. Mole weight: HO2C[CH2CH(CN)]x(CH2CH=CHCH2)yCO2H. C=CC=C.C=CC#N. InChI=1S/C4H6.C3H3N/c1-3-4-2; 1-2-3-4/h3-4H, 1-2H2; 2H, 1H2. NTXGQCSETZTARF-UHFFFAOYSA-N. | |
| Poly(p-toluenesulfonamide-co-formaldehyde) | Poly(p-toluenesulfonamide-co-formaldehyde). CAS No. 25035-71-6. Pack Sizes: 25 kg. Product ID: CDC10-0293. Molecular formula: C8H11NO3S. Category: Cosmetic Plasticizers. Product Keywords: Cosmetic Ingredients; Cosmetic Plasticizers; Poly(p-toluenesulfonamide-co-formaldehyde); CDC10-0293; 25035-71-6; C8H11NO3S; 25035-71-6. Purity: 0.99. Melting Point: 82 °C. Product Description: Toluenesulfonamide formaldehyde resin is used as intensifier and plasticizer in polyamide, epoxy resin, phenol-formaldehyde resin, printing inks, coatings etc.;Uses Toluene sulfonamide formaldehyde resin is used as modifier and adhesion promotor for film-forming natural and synthetic resins; in vinyllacquers, nitrocellulose compositions (naillacquers), polyvinyl alcohol adhesives, acrylics. |  |
| Tung oil | Tung oil is an excellent vegetable oil with drying properties. It has the characteristics of fast drying, light specific gravity, good gloss, strong adhesion, heat resistance, Acid resistance, Alkali resistance, corrosion resistance, rust resistance, non-conductivity, etc. It is widely used. It is the main raw material for the manufacture of paints and inks. It is widely used as waterproof, anti-corrosion and anti-rust coatings for construction, machinery, weapons, vehicles and boats, fishing gear, and electrical appliances. insecticides, etc. Uses: Tung oil is a plant oil that can be polymerized to produce a variety of products which include pressure sensitive adhesives, self-healed epoxy coatings, polyurethane foam, and vinyl ester resins. Additional or Alternative Names: China wood oil. Product Category: Polymer/Macromolecule. Appearance: Liquid. CAS No. 8001-20-5. Density: 0.937 g/mL at 25 °C (lit.). Product ID: ACM8001205. Alfa Chemistry ISO 9001:2015 Certified. | |
| Glycerol diglycidyl ether | Glycerol diglycidyl ether (GDE) is an aliphatic epoxy monomer that can be used as a diepoxy crosslinker. It has a low viscous epoxy matrix that can be cured with aliphatic amines to form a thermosetting material with good flexibility. Its properties include low shrinkage, good adhesion, and good thermo-mechanical properties. Uses: Gde can be used in the formation of epoxy materials, which can further be used in electrical instruments and biodegradable plastics. Additional or Alternative Names: 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol. Product Category: Epoxide Monomers. Appearance: Transparent liquid. CAS No. 27043-36-3. Molecular formula: C9H16O5. Mole weight: 204.22 g/mol. Purity: 0.95. Canonical SMILES: OCC(COCC1CO1)OCC2CO2.OC(COCC3CO3)COCC4CO4. Density: 1.229 g/mL at 25 °C (lit.). Product ID: ACM-MO-27043363. Alfa Chemistry ISO 9001:2015 Certified. | |
| Trimethylolpropane triglycidyl ether | Trimethylolpropane triglycidyl ether (TMPTE) has a trifunctional aliphatic glycidyl ether epoxide monomer mainly used as a crosslinking agent which provides chemical and mechanical resistance. Uses: Additive in fast-setting adhesives, low temperature curing coatings and hard, abrasion resistant castings and decoupage systems. tmpte is used in the synthesis of azidated trimethylolpropane triglycidyl ether for the preparation of polyether polyol based hyperbranched polyurethanes. it can be coated on polycarbonated chips for improving chemical resistance from different organic solvents. cross-linking of tmpte can be done with poly(4-venylphenol) (pvp) for the preparation of organic field effect transistors (ofets). Group: Polymers. Alternative Names: Triglycidyl trimethylolpropane ether, 1,1,1-Trimethylolpropane triglycidyl ether, 2, 2'- ( ( (2-Ethyl-2- ( (oxiran-2-ylmethoxy)methyl)propane-1, 3-diyl)bis (oxy))bis (methylene))bis (oxirane). CAS No. 30499-70-8. Pack Sizes: Packaging 250 mL in poly bottle 1 L in poly bottle. Product ID: 2-[2, 2-bis (oxiran-2-ylmethoxymethyl) butoxymethyl]oxirane. Molecular formula: 302.36. Mole weight: C15H26O6. CCC(COCC1CO1)(COCC2CO2)COCC3CO3. 1S/C15H26O6/c1-2-15 (9-16-3-12-6-19-12, 10-17-4-13-7-20-13) 11-18-5-14-8-21-14/h12-14H, 2-11H2, 1H3. QECCQGLIYMMHCR-UHFFFAOYSA-N. | |
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