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Epoxy resins Our wide distribution network, with locations coast-to-coast, helps guarantee fast, reliable service to Univar's customers. Univar Solutions
Epoxy Resins Solid. Group: Polymers. Alternative Names: Epoxy resin. CAS No. 61788-97-4. Product ID: 4-[4-(4-chlorophenyl)-4-hydroxypiperidin-1-yl]-1-(4-fluorophenyl)butan-1-one. Molecular formula: 375.9g/mol. Mole weight: C21H23ClFNO2. C1CN (CCC1 (C2=CC=C (C=C2)Cl)O)CCCC (=O)C3=CC=C (C=C3)F. InChI=1S/C21H23ClFNO2/c22-18-7-5-17 (6-8-18)21 (26)11-14-24 (15-12-21)13-1-2-20 (25)16-3-9-19 (23)10-4-16/h3-10, 26H, 1-2, 11-15H2. LNEPOXFFQSENCJ-UHFFFAOYSA-N. Alfa Chemistry Materials 4
d.e.r.(Dow epoxy resins),grade 732(55-100 cps) d.e.r.(Dow epoxy resins),grade 732(55-100 cps). Uses: Designed for use in research and industrial production. Additional or Alternative Names: 2-ethanediyl)]. alpha.-(oxiranylmethyl)-.omega.-(oxiranylmethoxy)-Poly[oxy(methyl-1;poly[oxy(methyl-1,2-ethanediyl)],alpha-(oxiranylmethyl)-omega-(oxiranylmetho;POLY(PROPYLENE GLYCOL) DIGLYCIDYL ETHER,AVERAGE MN CA. 380;POLY(PROPYLENE GLYCOL) DIGLYCIDYL E. Product Category: Polymer/Macromolecule. CAS No. 26142-30-3. Molecular formula: (C3H6O)n.C6H10O3. Mole weight: ~600. Product ID: ACM26142303. Alfa Chemistry — ISO 9001:2015 Certified. Alfa Chemistry.
d.e.r.(Dow epoxy resins),grade 736 d.e.r.(Dow epoxy resins),grade 736. Uses: Designed for use in research and industrial production. Additional or Alternative Names: 2,2'-[oxybis[(methyl-2,1-ethanediyl)oxymethylene]]bis-oxiran;2,2'-[oxybis[(methyl-2,1-ethanediyl)oxymethylene]]bis-Oxirane;Dipropyleneglycoldiglycidylether;PPG-DGE;POLY(PROPYLENE GLYCOL) (N) DIGLYCIDYL ETHER;POLY(PROPYLENE GLYCOL) DIGLYCIDYL ETHER;DER(R). Product Category: Polymer/Macromolecule. CAS No. 41638-13-5. Molecular formula: C12H22O5. Mole weight: 246.3. Purity: 0.96. IUPACName: 2-[2-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propoxymethyl]oxirane. Canonical SMILES: CC(COCC1CO1)OC(C)COCC2CO2. Density: 1.14 g/mL at 25 °C. ECNumber: 609-948-5. Product ID: ACM41638135. Alfa Chemistry — ISO 9001:2015 Certified. Alfa Chemistry. 2
1,4,7-Trimethyl-1,4,7-triazonane 1,4,7-Trimethyl-1,4,7-triazonane, also known as TMT or trimethylenetris(aziridine), is a cyclic organic compound. TMT is commonly used as a crosslinking agent and a precursor for polymer and resin synthesis. In addition, it is used as a stabilizer in the production of polyurethane foam and as a curing agent for epoxy resins. Due to its high reactivity and stability, TMT is considered to be a versatile and efficient reagent in various applications. Uses: Scientific research. Group: Biochemical assay reagents. Alternative Names: Me3TACN. CAS No. 96556-05-7. Pack Sizes: 100 mg; 500 mg. Product ID: HY-W051391. MedChemExpress MCE
1,4-Butanediol Diglycidyl Ether, 98% For post-crosslinking reactions, preparation of aliphatic epoxy resins. Group: Biochemicals. Alternative Names: 1, 4-Bis(2, 3-epoxypropoxy)butane;1, 4-Diglycidyloxybutane; Tetramethylene Glycol Diglycidyl Ether. Grades: Highly Purified. CAS No. 2425-79-8. Pack Sizes: 50g, 100g, 250g, 500g, 1Kg. Molecular Formula: C10H18O4, Molecular Weight: 202.25. US Biological Life Sciences. USBiological 6
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2-Chloro-5,5-dimethyl-1,3,2-dioxaphosphorinane 2-oxide 2-Chloro-5,5-dimethyl-1,3,2-dioxaphosphorinane 2-oxide is a reagent used in the preparation of phosphorus-based flame retardants containing 4-tert-butylcalix[4]arene for epoxy resins. Group: Biochemicals. Grades: Highly Purified. CAS No. 4090-55-5. Pack Sizes: 250mg, 2.5g. Molecular Formula: C5H10ClO3P, Molecular Weight: 184.56. US Biological Life Sciences. USBiological 10
Worldwide
2-Dimethylaminoethanol Dimethylaminoethanol is used as a curing agent for polyurethanes and epoxy resins. It is also used in mass quantities for water treatment, and to some extent in the coatings industry. It is used in the synthesis of dyestuffs, textile auxiliaries, pharmaceuticals, emulsifiers, and corrosion inhibitors. It is also an additive to paint removers, boiler water and amino resins. Group: Biochemicals. Grades: Highly Purified. CAS No. 108-01-0. Pack Sizes: 1g, 10g. Molecular Formula: C4H11NO, Molecular Weight: 89.14. US Biological Life Sciences. USBiological 10
Worldwide
2'-Hydroxy-2,4,4-trimethylflavan 2'-Hydroxy-2,4,4-trimethylflavan is an impurity formed in the synthesis of Bisphenol A (B519495, a monomer used for policarbonate and epoxy resins. Group: Biochemicals. Grades: Highly Purified. CAS No. 5026-12-0. Pack Sizes: 100mg, 1g. Molecular Formula: C18H20O2. US Biological Life Sciences. USBiological 10
Worldwide
3,5-Dichlorobisphenol A 3,5-Dichlorobisphenol A is an chlorinated derivative of Bisphenol A (B519495), a monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. Group: Biochemicals. Alternative Names: 2, 6-Dichloro-4, 4'-isopropyl idenediphenol; 2,6-dichloro-4-[1-(4-hydroxyphenyl)-1-methylethyl]phenol. Grades: Highly Purified. CAS No. 14151-65-6. Pack Sizes: 10mg. US Biological Life Sciences. USBiological 3
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3,5-Dichlorobisphenol A Applications: 3,5-Dichlorobisphenol A is an chlorinated derivative of Bisphenol A (B519495), a monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. Synonyms: 2,6-Dichloro-4,4'-isopropylidenediphenol||||2,6-dichloro-4-[1-(4-hydroxyphenyl)-1-methylethyl]phenol. CAS No. 14151-65-6. Molecular formula: C15H14Cl2O2. Mole weight: 297.18. BOC Sciences
4,4-(1-Phenylethylidene)bisphenol Applications: Bisphenol AP-d5 is the isotope labelled analog of Bisphenol AP. Bisphenol AP is used to prepare triphenylmethane derivatives as inhibitors of hepatitis C virus helicase. It is a derivative of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Synonyms: Bisphenol AP. Grade: >98.0%(GC). CAS No. 1571-75-1. Molecular formula: C20H18O2. Mole weight: 290.36. BOC Sciences
4',4'''-Azobisacetanilide 4,4’-Azodianiline (A940000) derivative, used in cross-linking studies of epoxy resins and the synthesis of surface relief holographic materials. Group: Biochemicals. Alternative Names: N,N'-(Azodi-4,1-phenylene)bis-acetamide; N,N'-(1,2-Diazenediyldi-4,1-phenylene)bis-acetamide; NSC 97288. Grades: Highly Purified. CAS No. 15446-39-6. Pack Sizes: 1g. US Biological Life Sciences. USBiological 3
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4,4’-Azodianiline 4,4’-Azodianiline is used in cross-linking studies of epoxy resins and the synthesis of surface relief holographic materials. Group: Biochemicals. Alternative Names: 4,4'-(1,2-Diazenediyl)bis-benzenamine; 4,4'-Azodi-aniline; 4,4'-Azobis-benzenamine; 4,4'-Diaminoazobenzene; NSC 17103; p,p'-Diaminoazobenzene; p-Azoaniline; p-Diaminoazobenzene; p'-Amino-p-aminoazobenzene. Grades: Highly Purified. CAS No. 538-41-0. Pack Sizes: 1g. US Biological Life Sciences. USBiological 3
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4,4'-ETHYLIDENEBISPHENOL Applications: Bisphenol E is a derivative of Bisphenol A (B519495) which is a monomer used for polycarbonate and epoxy resins. Synonyms: BISPHENOL E; 4,4'-ETHYLIDENEBISPHENOL; 4,4'-ETHYLIDENEDIPHENOL; 1,1-BIS(4-HYDROXYPHENYL)ETHANE; Ethylidenebisphenol; 4,4'-ETHYLIDENEBISPHENOL 99%; 4,4'-ETHYLIDENEBISPHENOL 98+%; 4,4'-(Methylmethylene)bisphenol. Grade: >98.0%(GC). CAS No. 2081-8-5. Molecular formula: C14H12O2. Mole weight: 212.24. BOC Sciences
4,4'-Methylenedianiline 4,4'-Methylenedianiline is used in the production of polyurethane foams and epoxy resins (1). Potential contributor in pulmonary arterial hypertension (PAH) in rats through alteration of the serotenergic transport system (2). Drinking water contaminant candidate list 3 (CCL 3) compound as per United States Environmental Protection Agency (EPA), environmental, and food contaminants. Group: Biochemicals. Grades: Highly Purified. CAS No. 101-77-9. Pack Sizes: 1g, 5g. Molecular Formula: C13H14N2. US Biological Life Sciences. USBiological 5
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4,4-Methylenedianiline-[d2] 4,4-Methylenedianiline-[d2] is the labelled analogue of 4,4-Methylenedianiline, which is used in the production of polyurethane foams and epoxy resins. Synonyms: 4,4-Methylene-d2-dianiline; p,p'-Methylenebisaniline-d2; 4,4-Diaminodiphenylmethane-d2; 4,4'-Diaminodiphenylenemethane-d2; 4,4'-Methylenebis(aniline)-d2; 4-(p-Aminobenzyl)aniline-d2; Bis(4-aminophenyl)methane-d2; Bis(p-aminophenyl)methane-d2; DAM-d2; DDM-d2; Di(4-aminophenyl)methane-d2; Diaminodiphenylmethane-d2. Grade: 98%; 98% atom D. CAS No. 215590-72-0. Molecular formula: C13H12D2N2. Mole weight: 200.28. BOC Sciences 2
4-Isopropenylphenol 4-Isopropenylphenol is an intermediate in the synthesis of 3,5-Dichlorobisphenol A (D433555), a monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. Group: Biochemicals. Alternative Names: p-Hydroxy-α-methylstyrene; p-Isopropenylphenol; 2-(4-Hydroxyphenyl)propene; 4-(1-Methylethenyl)phenol; 4-(1-Propen-2-yl)phenol; 4-Hydroxy-α-methylstyrene; p-Isopropenylphenol; 4-(1-Methylethenyl)-phenol. Grades: Highly Purified. CAS No. 4286-23-1. Pack Sizes: 25mg. US Biological Life Sciences. USBiological 3
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Bisphenol A Bisphenol A is a monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. BPA is also used as a building block in polycarbonate bottles and in the epoxy-resin liners of metal cans. This compound is a contaminant of emerging concern (CECs). Group: Biochemicals. Alternative Names: 4, 4'- (1-Methylethylidene) bisphenol; 2,2-Bis(4-hydroxyphenyl)propane; BPA; (4, 4'-Dihydroxydiphenyl) dimethylmethane; 4, 4'-Isopropyl idenediphenol; 4, 4'- methyl ethylidenebisphenol; Dian; Diano; Diphenylolpropane; HT 3082; Parabis; p,p'-Bisphenol A. Grades: Highly Purified. CAS No. 80-05-7. Pack Sizes: 10g, 25g, 50g. Molecular Formula: C??H??O?, Molecular Weight: 228.29. US Biological Life Sciences. USBiological 2
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Bisphenol A Bisphenol A is a phenolic, organic synthetic compound widely used in the production of polycarbonate plastics and epoxy resins. Bisphenol A is a reproductive, developmental, and systemic toxicant, often classified as an endocrine-disrupting compound (EDC). Bisphenol A is associated with many diseases, including cancers, cardiovascular diseases, respiratory diseases, diabetes, kidney diseases, obesity, and reproductivedisorders [1] [2] [3] [4] [5] [6] [7] [8] [9]. Uses: Scientific research. Group: Natural products. CAS No. 80-05-7. Pack Sizes: 10 mM * 1 mL; 100 mg. Product ID: HY-18260. MedChemExpress MCE
Bisphenol A-13C12 Labeled Bisphenol A. A monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. Group: Biochemicals. Alternative Names: 4, 4'- (1-Methylethylidene) bisphenol-13C12; 2,2-Bis(4-hydroxyphenyl)propane-13C12; (4, 4'-Dihydroxydiphenyl) dimethylmethane-13C12; 4,4'-Isopropylidenediphenol-13C12. Grades: Highly Purified. CAS No. 263261-65-0. Pack Sizes: 2.5mg. Molecular Formula: C?¹³C??H??O?, Molecular Weight: 240.2. US Biological Life Sciences. USBiological 2
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Bisphenol A-13C12 β-D-Glucuronide Isotope labelled Bisphenol A β-D-Glucuronide is the glucuronide conjugate and metabolite of bisphenol A (B519495), an monomer used for policarbonate and epoxy resins. Group: Biochemicals. Alternative Names: 4-[1-(4-Hydroxyphenyl)-1-methylethyl]phenyl β-D-Glucopyranosiduronic Acid-13C12. Grades: Highly Purified. CAS No. 1313730-08-3. Pack Sizes: 1mg. US Biological Life Sciences. USBiological 3
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Bisphenol A-d14 Applications: Bisphenol A-d14 is an isotope labelled form of Bisphenol A(B519495). Bisphenol A is a monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. Bisphenol A is also used as a building block in polycarbonate bottles and in the epoxy-resin liners of metal cans.Dangerous Goods Info: Not a dangerous good if item is equal to or less than 1g/ml and there is less than 100g/ml in the package. Synonyms: 4,4'-[1-(Methyl-d3)ethylidene-2,2,2-d3]bis[phen-2,3,5,6-d4-ol]Bisphenol A-d14. CAS No. 120155-79-5. Molecular formula: C15H2D14O2. Mole weight: 242.37. BOC Sciences
Bisphenol A-d16 Bisphenol A-d 16 is the deuterium labeled Bisphenol A[1]. Bisphenol A is a phenolic, organic synthetic compound widely used in the production of polycarbonate plastics and epoxy resins. Bisphenol A is a reproductive, developmental, and systemic toxicant, often classified as an endocrine-disrupting compound (EDC). Bisphenol A is associated with many diseases, including cardiovascular diseases, respiratory diseases, diabetes, kidney diseases, obesity, and reproductivedisorders[2][3]. Uses: Scientific research. Group: Isotope-labeled compounds. CAS No. 96210-87-6. Pack Sizes: 10 mg; 25 mg; 50 mg; 100 mg. Product ID: HY-18260S. MedChemExpress MCE
Bisphenol A-d6 Bisphenol A-d 6 is the deuterium labeled Bisphenol A. Bisphenol A is a phenolic, organic synthetic compound widely used in the production of polycarbonate plastics and epoxy resins. Bisphenol A is a reproductive, developmental, and systemic toxicant, often classified as an endocrine-disrupting compound (EDC). Bisphenol A is associated with many diseases, including cardiovascular diseases, respiratory diseases, diabetes, kidney diseases, obesity, and reproductivedisorders[1][2][3]. Uses: Scientific research. Group: Isotope-labeled compounds. CAS No. 86588-58-1. Pack Sizes: 5 mg; 10 mg; 25 mg. Product ID: HY-18260S1. MedChemExpress MCE
Bisphenol A-d6 Labeled Bisphenol A. A monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. Group: Biochemicals. Alternative Names: 4,4'-[1-(Methyl-d3)ethylidene-2,2,2-d3]bisphenol; 2,2-Bis(4-hydroxyphenyl)propane-d6; (4, 4'-Dihydroxydiphenyl) dimethylmethane-d6. Grades: Highly Purified. CAS No. 86588-58-1. Pack Sizes: 25mg. US Biological Life Sciences. USBiological 2
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Bisphenol A Impurity 1-d8 An impurity of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Grade: > 95%. Molecular formula: C21H16O4D8. Mole weight: 348.47. BOC Sciences
Bisphenol A Impurity 3-d8 An impurity of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Grade: > 95%. Molecular formula: C21H18O5D8. Mole weight: 366.49. BOC Sciences
Bisphenol A Impurity 5-d8 An impurity of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Grade: > 95%. Molecular formula: C21H18Cl2O4D8. Mole weight: 421.39. BOC Sciences
Bisphenol A Impurity 7-d4 An impurity of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Grade: > 95%. Molecular formula: C19H20O6D4. Mole weight: 352.42. BOC Sciences
Bisphenol A Impurity 8-d8 An impurity of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Grade: > 95%. Molecular formula: C19H18Cl2O4D4. Mole weight: 389.31. BOC Sciences
Bisphenol A Impurity 9-d4 An impurity of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Grade: > 95%. Molecular formula: C19H16O4D4. Mole weight: 316.39. BOC Sciences
Bisphenol A mono-β-D-glucuronide-[13C12] Applications: Isotope labelled Bisphenol A β-D-Glucuronide is the glucuronide conjugate and metabolite of bisphenol A (B519495), an monomer used for policarbonate and epoxy resins. Synonyms: Bisphenol A-(rings-13C12) mono-β-D-glucuronide; Bisphenol A mono-β-D-glucuronide-(rings-13C12). Grade: 95% (CP); 99% atom 13C. CAS No. 1313730-08-3. Molecular formula: C9[13C]12H24O8. Mole weight: 416.32. BOC Sciences
Bisphenol A Monosulfate Disodium Bisphenol A Monosulfate is a derivative of Bisphenol A, a monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. BPA is also used as a building block in polycarbonate bottles and in the epoxy-resin liners of metal cans. Group: Biochemicals. Alternative Names: [4-[2-(4-hydroxyphenyl)propan-2-yl]phenyl] sulfate, sodium. Grades: Highly Purified. CAS No. 847696-37-1. Pack Sizes: 10mg. Molecular Formula: C??H??NaO?S, Molecular Weight: 330.33. US Biological Life Sciences. USBiological 3
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Bisphenol A Monosulfate Sodium Salt Applications: Bisphenol A Monosulfate Sodium Salt-d6 is the isotope labelled analog of Bisphenol A Monosulfate Sodium Salt (B519560); a derivative of Bisphenol A (B519495) which is a monomer used for policarbonate and epoxy resins; exhibits estrogenic activity. BPA is also used as a building block in polycarbonate bottles and in the epoxy-resin liners of metal cans. Synonyms: sodium; [4-[2-(4-hydroxyphenyl)propan-2-yl]phenyl] sulfate; Sodium 4-(2-(4-hydroxyphenyl)propan-2-yl)phenyl sulfate; Sodium 4-[2-(4-hydroxyphenyl)propan-2-yl]phenyl sulfate; Bisphenol A sulfate sodium salt, 95% (CP). CAS No. 847696-37-1. Molecular formula: C15H15NaO5S. Mole weight: 330.33. BOC Sciences
Bisphenol AP-[13C12] Bisphenol AP-[13C12] is a stable isotope labelled Bisphenol AP, which is intended for use as an internal standard for the quantification of BPAP by LC or GC-mass spectrometry. Bisphenol AP is a derivative of Bisphenol A which is a monomer used for policarbonate and epoxy resins. Synonyms: Bisphenol AP-13C12; 4,4'-(1-phenylethane-1,1-diyl)bis(phenol-13C6). Molecular formula: C8[13C]12H18O24. Mole weight: 302.27. BOC Sciences
Bisphenol A (Standard) Bisphenol A (Standard) is the analytical standard of Bisphenol A. This product is intended for research and analytical applications. Bisphenol A is a phenolic, organic synthetic compound widely used in the production of polycarbonate plastics and epoxy resins. Bisphenol A is a reproductive, developmental, and systemic toxicant, often classified as an endocrine-disrupting compound (EDC). Bisphenol A is associated with many diseases, including cardiovascular diseases, respiratory diseases, diabetes, kidney diseases, obesity, and reproductivedisorders [1] [2] [3]. Uses: Scientific research. Group: Natural products. CAS No. 80-05-7. Pack Sizes: 10 mg; 25 mg; 50 mg; 100 mg. Product ID: HY-18260R. MedChemExpress MCE
Bisphenol B Mono-b-D-glucuronide Bisphenol B Mono-b-D-glucuronide is a metabolite of Bisphenol B (B519565), which is the analogue of Bisphenol A (B519495), that is used to make certain plastic an epoxy resins. BPA and its analogs, are also shown to activate human pregnane X receptor (PXR), a nuclear receptor that functions as a master regulator of xenobiotic metabolism. Synonyms: (2S,3S,4S,5R,6S)-3,4,5-Trihydroxy-6-(4-(2-(4-hydroxyphenyl)butan-2-yl)phenoxy)tetrahydro-2H-pyran-2-carboxylic Acid; BPB β-D-Glucuronide. Molecular formula: C22H26O8. Mole weight: 418.44. BOC Sciences
Bisphenol B Monobenzyl Ether Bisphenol B Monobenzyl Ether is an intermediate in the synthesis of Bisphenol B Mono-b-D-glucuronide (B519463) which is a metabolite of Bisphenol B (B519565), which is the analogue of Bisphenol A (B519495), that is used to make certain plastic an epoxy resins. BPA and its analogs, are also shown to activate human pregnane X receptor (PXR), a nuclear receptor that functions as a master regulator of xenobiotic metabolism. Synonyms: 4-[1-Methyl-1-[4-(phenylmethoxy)phenyl]propyl]phenol; 4-(2-(4-(Benzyloxy)phenyl)butan-2-yl)phenol. CAS No. 152430-87-0. Molecular formula: C23H24O2. Mole weight: 332.44. BOC Sciences
Bisphenol E Bisphenol E is a derivative of Bisphenol A (B519495) which is a monomer used for polycarbonate and epoxy resins. Group: Biochemicals. Grades: Highly Purified. CAS No. 2081-8-5. Pack Sizes: 5mg, 10mg. Molecular Formula: C14H14O2. US Biological Life Sciences. USBiological 4
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Bisphenol P Applications: Bisphenol P-13C4 is an isotope labelled analog of Bisphenol P. Bisphenol P is a derivative of Bisphenol A (B519495) which is a monomer used for policarbonate and epoxy resins. Synonyms: Bisphenol P. Grade: >98.0%(GC). CAS No. 2167-51-3. Molecular formula: C24H26O2. Mole weight: 346.46. BOC Sciences
Bisphenol P Bisphenol P is a derivative of Bisphenol A (B519495) which is a monomer used for policarbonate and epoxy resins. Group: Biochemicals. Grades: Highly Purified. CAS No. 2167-51-3. Pack Sizes: 5g, 25g. Molecular Formula: C24H26O2. US Biological Life Sciences. USBiological 1
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Chlorendic acid Chlorendic acid appears as fine white free-flowing crystals or white powder. Odorless. (NTP, 1992). Uses: Chlorendic acid is used as a flame retardant in polyurethane foams, resins, plasticizers, coatings, epoxy resins, and wool fabrics; in the manufacture of alkyl resins for special paints and inks; in the manufacture of polyester resins with special applications in electrical systems,paneling, engineering plastics, and paint; and in the manufacture of corrosion-resistant tanks, piping, and scrubbers. Group: Self assembly and contact printing materials monomerspolymers. Alternative Names: 1, ?4, ?5, ?6, ?7, ?7-Hexachloro-5-norbornene-2, ?3-dicarboxylic Acid; 1,4,5,6,7,7-Hexachlorobicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic Acid; 1,4,5,6,7,7-Hexachloro-5-norbornene-2,3-dicarboxylic Acid; 1,4,5,6,7,7-Hexachlorobicyclo-(2,2,1)hept-5-en-2,3-dicarboxylic Acid; 1,4,5,6,7,7-Hexachlorodicyclo-(2.2.1)-5-heptene-2,3-dicarboxylic Acid; 2H,3H-Hexachlorobicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic Acid; Chlorendic Acid; HET Acid; Hexachloroendo methyl enetetrahydrophthalic Acid; NSC 22231; NSC 41876. CAS No. 115-28-6. Product ID: 1,4,5,6,7,7-hexachlorobicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid. Molecular formula: 388.84. Mole weight: C9H4Cl6O4. OC (=O)C1C (C (O)=O)[C@]2 (Cl)C (Cl)=C (Cl)[C@@]1 (Cl)C2 (Cl)Cl. 1S/C9H4Cl6O4/c10-3-4 (11)8 (13)2 (6 (18)19)1 (5 (16)17)7 (3, 12)9 (8, 14)15/h1-2H, (H, 16, 17) (H, 18, 19)/t1?, 2?, 7-, 8+. DJKG Alfa Chemistry Materials 4
Dicyandiamide DryPowder; Liquid; OtherSolid; PelletsLargeCrystals;WHITE CRYSTALLINE POWDER. Uses: Dicyandiamide is used in the production of special resins, flame retardants, guanidine salts, etc., used as fillers in artificial leather, and used as a curing agent on adhesives. the printing and dyeing industry use dicyandiamide to manufacture fixing agents. the leather industry use it to make leather retanning agents. water treatment industry use it to make decolorant or flocculant. it can be used in electroplating and manufacturing steel surface hardener. it can also be used as fertilizer nitrification inhibitor in agriculture. electronic grade dicyandiamide is mainly used for epoxy resin curing agents in the manufacture of copper clad laminates for the electronic information industry, inner coating films for food and beverage metal packaging, high-grade non-toxic flame retardants, additives for food plastics, special pharmaceutical intermediates. Group: Polymerization reagents. CAS No. 461-58-5. Product ID: 2-cyanoguanidine. Molecular formula: 84.08. Mole weight: C2H4N4. NC(=N)NC#N. 1S/C2H4N4/c3-1-6-2(4)5/h(H4,4,5,6). QGBSISYHAICWAH-UHFFFAOYSA-N. 99.5%, electronic grade 99.7%. Alfa Chemistry Materials 4
Dicyandiamide-[13C2,15N2] Labelled Dicyandiamide. Dicyandiamide is used for the curing of epoxy resins. Synonyms: 1-Cyano-13C,15N-guanidine-13C,15N; Dicyandiamide-13C2,15N2; 2-Cyanoguanidine-13C2,15N2; 1-Cyanoguanidine-13C2,15N2; N-Cyanoguanidine-13C2,15N2. Grade: 95% by HPLC; 98% atom 13C; 98% atom 15N. Molecular formula: [13C]2H4N2[15N]2. Mole weight: 88.05. BOC Sciences 2
Epichlorohydrin Epichlorohydrin is used as a solvent for natural and synthetic resins, gums, cellulose esters and ethers, paints, varnishes, nail enamels and lacquers, cement for Celluloid. Also, it is used as stabilizer. Group: Biochemicals. Alternative Names: 2-(Chloromethyl)oxirane; (Chloromethyl)ethylene Oxide; (Chloromethyl)oxirane; (RS)-Epichlorhydrin; (+/-)-Epichlorohydrin; 1,2-Epoxy-3-chloropropane; 1-Chloro-2,3-epoxypropane; 2,3-Epoxypropyl Chloride. Grades: Highly Purified. CAS No. 106-89-8. Pack Sizes: 50g. US Biological Life Sciences. USBiological 3
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Epichlorohydrin-d5 Used as a solvent for natural and synthetic resins, gums, cellulose esters and ethers, paints, varnishes, nail enamels and lacquers, cement for Celluloid. Also, it is used as stabilizer. Group: Biochemicals. Alternative Names: 2-(Chloromethyl)oxirane-d5; (Chloromethyl)ethylene-d5 Oxide; (Chloromethyl)oxirane-d5; (RS)-Epichlorhydrin-d5; (+/-)-Epichlorohydrin-d5; 1,2-Epoxy-3-chloropropane-d5; 1-Chloro-2,3-epoxypropane-d5; 2,3-Epoxypropyl Chloride-d5. Grades: Highly Purified. CAS No. 69533-54-6. Pack Sizes: 10mg. US Biological Life Sciences. USBiological 2
Worldwide
Low Molecular Weight Polyamide Resin ALFA01 This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc.
as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting.
as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA02 This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc.
as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting.
as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA03 This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc.
as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting.
as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA04 This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc.
as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting.
as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA05 This liquid polyamide resin is a product made by condensation of dimeric acid (or ester) with polyethylene amine. All models in this series do not contain any solvents. Uses: As coating: with epoxy resin, it has the advantages of strong adhesion, aging resistance, rust prevention, etc.
as adhesive: widely used in the bonding of metal and non-metal, used in the automobile, aircraft and other manufacturing industries in part of the components of the bonding, instead of metal riveting.
as electrical insulation paint: with epoxy resin, used for electrical and electronic industrial parts insulation and rust prevention. Group: Low molecular weight polyamide resins.
Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA06 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA07 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA08 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA09 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA10 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA11 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA12 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA13 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA14 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA15 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA16 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
Low Molecular Weight Polyamide Resin ALFA17 The low molecular polyamide resin is dimer vegetable oleic acid and fatty amine condensation surface into an excellent epoxy resin curing agent. Uses: The product can be widely used in coating, packaging, adhesive, electronic industry and other industries. Group: Low molecular weight polyamide resins. Alfa Chemistry Materials 3
MTHPA (Methyl Tetrahydrophthalic Anhydride) MTHPA (Methyl Tetrahydrophthalic Anhydride). Group: Epoxy resins. Alfa Chemistry Materials 3
Poly(p-toluenesulfonamide-co-formaldehyde) Poly(p-toluenesulfonamide-co-formaldehyde). CAS No. 25035-71-6. Pack Sizes: 25 kg. Product ID: CDC10-0293. Molecular formula: C8H11NO3S. Category: Cosmetic Plasticizers. Product Keywords: Cosmetic Ingredients; Cosmetic Plasticizers; Poly(p-toluenesulfonamide-co-formaldehyde); CDC10-0293; 25035-71-6; C8H11NO3S; 25035-71-6. Purity: 0.99. Melting Point: 82 °C. Product Description: Toluenesulfonamide formaldehyde resin is used as intensifier and plasticizer in polyamide, epoxy resin, phenol-formaldehyde resin, printing inks, coatings etc.;Uses Toluene sulfonamide formaldehyde resin is used as modifier and adhesion promotor for film-forming natural and synthetic resins; in vinyllacquers, nitrocellulose compositions (naillacquers), polyvinyl alcohol adhesives, acrylics. CD Formulation
Tris(1,3-Dichloro-2-Propyl) Phosphate (TDCPP) Chlorinated phosphate flame retardant for polyurethane and epoxy resins. Meets California TB117, UL 94 HF-1 standards. Uses: Polyurethane foam, resins, textiles. Group: Flame retardant. Alternative Names: TDCPP. Grades: Industrial Grade. Approvals: RoHS Compliant. CAS No. 13674-87-8. Pack Sizes: 200kg drum / 1000kg IBC / 20MT ISO TANK. Product ID: FG-TDCPP. Flamisol
United States (serving international markets)
Tung oil Tung oil is an excellent vegetable oil with drying properties. It has the characteristics of fast drying, light specific gravity, good gloss, strong adhesion, heat resistance, Acid resistance, Alkali resistance, corrosion resistance, rust resistance, non-conductivity, etc. It is widely used. It is the main raw material for the manufacture of paints and inks. It is widely used as waterproof, anti-corrosion and anti-rust coatings for construction, machinery, weapons, vehicles and boats, fishing gear, and electrical appliances. insecticides, etc. Uses: Tung oil is a plant oil that can be polymerized to produce a variety of products which include pressure sensitive adhesives, self-healed epoxy coatings, polyurethane foam, and vinyl ester resins. Additional or Alternative Names: China wood oil. Product Category: Polymer/Macromolecule. Appearance: Liquid. CAS No. 8001-20-5. Density: 0.937 g/mL at 25 °C (lit.). Product ID: ACM8001205. Alfa Chemistry — ISO 9001:2015 Certified. Alfa Chemistry.
1- ( (4- ( (4-Hydroxyphenyl) sulfonyl) phenoxy) sulfonyl) pyridin-1-ium 1- ( (4- ( (4-Hydroxyphenyl) sulfonyl) phenoxy) sulfonyl) pyridin-1-ium is an intermediate in synthesizing Bisphenol S Monosulfate (B519625), a metabolite of Bisphenol S (B447390), which is a commonly used as a reactant in epoxy reactions and is also used as a latent thermal catalyst for epoxy resin. Group: Biochemicals. Grades: Highly Purified. Pack Sizes: 100mg, 250mg. Molecular Formula: C17H14NO6S2+, Molecular Weight: 392.43. US Biological Life Sciences. USBiological 9
Worldwide
(2R)-2-Oxiranylmethyl Ester Butanoic Acid A reagent used in the synthesis of glycidol, a stabilizer in manufacturing of vinyl polymers; intermediate in synthesis of glycerol, glycidyl ethers, and amines; additive for oil and synthetic hydraulic fluids; epoxy resin diluent. Group: Biochemicals. Alternative Names: (R)-Oxiranylmethyl Ester Butanoic Acid; (-)-Glycidyl Butyrate; (2R)-(-)-Glycidyl Butyrate; (R)-(-)-Glycidyl Butyrate; (R)-Glycidyl Butyrate; (R)-Glycidyl Ester Butyric Acid. Grades: Highly Purified. CAS No. 60456-26-0. Pack Sizes: 10g. US Biological Life Sciences. USBiological 3
Worldwide

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