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| Product | Description | |
|---|---|---|
| Copper(l) bromide | Copper(l) bromide. Group: Biochemicals. Grades: Highly Purified. CAS No. 7787-70-4. Pack Sizes: 100g, 250g, 500g, 1kg, 2kg. Molecular Formula: BrCu. US Biological Life Sciences. |  Worldwide |
| Copper (ll) acetate monohydrate | 1kg Pack Size. Group: Inorganic Chemicals, Salts. Formula: C4H6CuO4 · H2O. CAS No. 6046-93-1. Prepack ID 45431130-1kg. Molecular Weight 199.65. See USA prepack pricing. |  |
| Copper Manganese Nickel wire, 0.1mm (0.004in) dia | Copper Manganese Nickel wire, 0.1mm (0.004in) dia. Group: Alloys. |  |
| Copper Manganese Nickel wire, 1.0mm (0.04in) dia | Copper Manganese Nickel wire, 1.0mm (0.04in) dia. Group: Alloys. | |
| Copper Metal | COPPER METAL, POWDER, 99.9% pure, -325 mesh, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! |  Texas TX |
| Copper Metal | COPPER METAL, SLUGS, 99.999% pure, 6.35 mm dia. x 6.35 mm, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, ROD, 99.999% pure, 12.7 mm diameter x 15 cm long Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, POWDER, 99.5% pure, -325 mesh, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, ROD, 99.99% pure, 32 mm diameter, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, ROD, 99.999% pure, 25.4 mm diameter, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, ROD, 99.999% pure, 19 mm diameter x 15 cm long, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, SHOT, 99.9% pure, ACS Reagent, 3-6 mm, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, SHOT, 99.99% pure, 3-6 mm, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, POWDER, 99.9% pure, -100 mesh, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal | COPPER METAL, POWDER, 99.8% pure, spheroidal, 3 micron diameter, Formula: Cu. CAS No. 7440-50-8. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper Metal Foam | Copper Metal Foam. Group: Metal foams. ≥99.8%. | |
| Copper Metal Organic Framework | Copper Metal Organic Framework. Group: other nano materials. CAS No. 7440-50-8. Molecular formula: 604.87 g/ mol. Mole weight: C18H6Cu3O12. 99%. | |
| Copper Metal-Organic Framework | Copper Metal-Organic Framework. Group: Metal organic framework. CAS No. 7440-50-8. Molecular formula: 604.87 g/ mol. Mole weight: C18H6Cu3O12. 99%. | |
| Copper MOF | Copper MOF. Group: other nano materials metal organic framework. CAS No. 7440-50-8. Molecular formula: 604.87 g/ mol. Mole weight: C27H18Cu3O6. 99%. | |
| Copper molybdate | Copper molybdate. Uses: Designed for use in research and industrial production. Additional or Alternative Names: CUPRIC MOLYBDATE;COPPER(II) MOLYBDATE;COPPER MOLYBDATE;COPPER MOLYBDENUM OXIDE;copper molybdenum tetraoxide;Molybdic acid copper(II) salt. Product Category: Metal & Ceramic Materials. Appearance: Powder. CAS No. 13767-34-5. Molecular formula: CuMoO4. Mole weight: 223.48. Purity: 0.96. IUPACName: copper dioxido(dioxo)molybdenum. Density: 3.4. Product ID: ACM13767345. Alfa Chemistry ISO 9001:2015 Certified. |  |
| Copper Nanodispersion | Copper Nanodispersion. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. 99.9%. | |
| Copper Nano Dispersion | Copper Nano Dispersion. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.55g/mol. Mole weight: Cu. 99.9%. | |
| Copper Nanofoil | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55g/mol. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. 99.9%, 99.99%, 99.999%. | |
| Copper Nanoparticle | Copper Nanoparticle. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. Mole weight: Cu. 99.9%. | |
| Copper Nanoparticles | Copper Nanoparticles. Group: Elements nanoparticlesmetal nano dispersion. 99.9%+. | |
| Copper Nanoparticles Dispersion | Copper Nanoparticles Dispersion. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.55g/mol. Mole weight: Cu. 99.9 %. | |
| Copper Nanoparticles Ink | Copper Nanoparticles Ink. Group: Oxide nano dispersionmetal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.55g/mol. Mole weight: Cu. 99.9 %. | |
| Copper nanopowder | Copper nanopowder. Group: Nanofibers. 99.9% (metal basis). | |
| Copper nano Powder | Copper nano Powder. Group: Metal nano dispersion. 0.998. | |
| Copper Nanopowder | Copper Nanopowder. Group: Metal nano dispersion. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. Mole weight: Cu. 99.9%. | |
| Copper Nanorods | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanorods | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanorods. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanorods Properties | Copper Nanorods Properties. Group: Nanorods. CAS No. 7440-50-8. Molecular formula: 63.546 g/mol. (99%, 99.9%, 99.99%). | |
| Copper Nanotubes | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanotubes. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanotubes | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. 99%, 99.9%, 99.99%, 99.999%. | |
| Copper Nanotubes Properties | Copper Nanotubes Properties. Group: Nanotubes. CAS No. 7440-50-8. Molecular formula: 63.55 g/mol. (99%, 99.9%, 99.99%). | |
| Copper Nanowire | Copper Nanowire. Group: Nanowires. ≥96.5. | |
| Copper Nanowire Dispersion | Copper Nanowire Dispersion. Group: Nanowires. Product ID: copper. Molecular formula: 63.55. [Cu]. | |
| Copper nanowire dispersion (20nm) | Copper nanowire dispersion (20nm). Group: Nanowires. | |
| Copper nanowire dispersion (40nm) | Copper nanowire dispersion (40nm). Group: Nanowires. | |
| Copper nanowires | Copper nanowires. Group: Nanowires. ≥ 96.5 %. | |
| Copper nanowires | Copper nanowires. Group: Nanoparticles. ≥ 96.5 %. | |
| Copper Nanowires | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Metal. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. InChI=1S/Cu. RYGMFSIKBFXOCR-UHFFFAOYSA-N. > 99.99%. | |
| Copper Nanowires | Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid. Group: Nanowires. Alternative Names: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper. CAS No. 7440-50-8. Product ID: copper. Molecular formula: 63.55. Mole weight: Cu. [Cu]. > 99.99%. | |
| Copper nanowires 100nm*10um | Copper nanowires 100nm*10um. Group: Nanowires. | |
| Copper Nanowires, 40-50 nm | Copper Nanowires, 40-50 nm. Group: other s. | |
| Copper Nanowires Properties | Copper Nanowires Properties. Group: Nanowires. CAS No. 7440-50-8. Molecular formula: 63.55 g/mol. (99%, 99.9%, 99.99%). | |
| Copper Nickel Alloy nanoparticles | Copper Nickel Alloy nanoparticles. Group: Compounds nanoparticles. | |
| Copper Nickel Alloy Nanopowder | Copper Nickel Alloy Nanopowder. Group: Alloys nanopowders. Mole weight: Cu/Ni. 99.9%. | |
| Copper Nickel Cu-Ni Alloy Powder | Copper Nickel Cu-Ni Alloy Powder. Uses: Manufacture multi-layer ceramic capacitor terminals and internal electrodes, electronic components, electronic paste, etc. Group: Alloy powders. >99.5%. | |
| Copper Nickel (Cu-Ni) Alloy Sputtering Targets | Copper Nickel (Cu-Ni) Alloy Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Nickel (Cu-Ni) Alloy Sputtering Targets, Cu-Ni Alloy Sputtering Target, Cu-Ni Alloy Sputter Target, Cu-Ni Alloy Target, Copper Nickel Alloy Sputtering Target, Copper Nickel Alloy Sputter Target, Copper Nickel Alloy Target. CAS No. 12064-62-9. 99.95%. | |
| Copper Nickel Foil | Copper Nickel Foil. Group: Metal foils. CAS No. 471-34-1. ≥99.9%. | |
| Copper Nickel Sulfide | Copper Nickel Sulfide. Group: Battery materials. | |
| Copper Nickel wire, 0.075mm (0.003in) dia | Copper Nickel wire, 0.075mm (0.003in) dia. Group: Alloys. | |
| Copper Nickel wire, 0.13mm (0.005in) dia | Copper Nickel wire, 0.13mm (0.005in) dia. Group: Alloys. | |
| Copper Nickel wire, 0.25mm (0.01in) dia | Copper Nickel wire, 0.25mm (0.01in) dia. Group: Alloys. | |
| Copper Nickel wire, 0.5mm (0.02in) dia | Copper Nickel wire, 0.5mm (0.02in) dia. Group: Alloys. | |
| Copper Nickel wire, 1.6mm (0.064in) dia | Copper Nickel wire, 1.6mm (0.064in) dia. Group: Alloys. | |
| Copper Nitride | COPPER NITRIDE, 99.5% pure, -200 mesh, Formula: Cu3N. CAS No. 1308-80-1. Noah Chemicals San Antonio, Texas. ISO 9001:2015 Certified. Request a Quote Today! | Texas TX |
| Copper No.1 Etchant | Copper & Brass (nitric acid and DI water). Group: Etchants. | |
| Copper No.2 Etchant | Copper & Brass (HCl and ferric chloride). Group: Etchants. | |
| Copper (O) | certified Reference Material, rod. Group: Certified reference materials (crms). |  |
| Copper Oxide Aluminium Core Shell | Copper Oxide Aluminium Core Shell. Group: Core shell nanoparticles. 99.9%. | |
| Copper Oxide (CuO) | Copper Oxide (CuO). Group: Magnetic nanoparticles. Alternative Names: High Purity Copper Oxide (CuO); 99.99% Copper Oxide (CuO); 99.999% Copper Oxide (CuO); ; high purity copper oxide; high purity copper(II) oxide; high purity cupric oxide. 3N-4N. | |
| Copper Oxide (CuO) Nano Powder | Copper Oxide (CuO) Nano Powder. Group: Oxides nanoparticles. 99.9%. | |
| Copper Oxide (CuO) Sputtering Targets | Copper Oxide (CuO) Sputtering Targets. Group: Sputtering targets. Alternative Names: Copper Oxide (CuO) Sputtering Targets, CuO Sputtering Target, CuO Sputter Target, CuO Target, Copper Oxide Sputtering Target, Copper Oxide Sputter Target, Copper Oxide Target. 99.7%. | |
| Copper Oxide Dispersion | Copper Oxide Dispersion. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9 %. | |
| Copper Oxide Ink | Copper Oxide Ink. Group: Oxide nano dispersion. CAS No. 1317-38-0. Mole weight: CuO. 99.9%. | |
| Copper oxide nano-chains | Copper oxide nano-chains. Group: Nanoparticles. CAS No. 1317-38-0. | |
| Copper oxide nanoparticles | Copper oxide nanoparticles. Group: Oxides nanoparticleselements nanoparticlescompounds nanoparticles. >99.9%. | |
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